Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Shape: ROUND; No. of Functions: 1; Semiconductor Material: GaAlAs;
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Infrared LEDs TLN238(F) attributes and parameters. Explore more Infrared LEDs devices from Toshiba
Configuration:
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Maximum Forward Voltage:
Mounting Feature:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optoelectronic Type:
Peak Wavelength (nm):
Maximum Reverse Voltage:
Semiconductor Material:
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Viewing Angle:
TLN238(F) Optoelectronics trade compliance attributes, and parameters.
HTS
8541.40.20.00
SB
TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
2N2222A
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
1N4148WS
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Taitron Components
EU2B-YS303C
Idec
ROTARY SWITCH;
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
0460-202-16141
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
MMBT2222ALT1G
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IRL80A
Infineon Technologies
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Peak Wavelength (nm): 950; Viewing Angle: 70 deg; JESD-609 Code: e0;
TIL47
Texas Instruments
INFRARED LED; Peak Wavelength (nm): 940; No. of LEDs in Array: 7; Color At Wavelength: INFRARED; Maximum Forward Voltage: 1.6 V;
SFH4546
Osram Opto Semiconductors
SFH4546 by Osram Opto Semiconductors is a single configuration infrared LED with a size of 4.85mm and peak wavelength of 950nm. It has a max forward current of 0.1A, making it ideal for applications requiring high power output in infrared illumination or sensing systems. With a viewing angle of 20° and spectral bandwidth of 42m, this IR LED is suitable for use in security cameras, proximity sensors, and industrial automation equipment.
TSML1030
Telefunken Microelectronics
Infrared LEDs; Mounting Feature: SURFACE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Peak Wavelength (nm): 950; Maximum Forward Current: .1 A; Maximum Operating Temperature: 85 Cel;
SLR938A8
SLR938A8 by Onsemi is an Infrared LED with 0.1A forward current, 945nm peak wavelength, and 80 °C max operating temp. Ideal for applications requiring IR illumination in environments ranging from -25°C to 80°C.
SFH416-Q
INFRARED LED; No. of Functions: 1; Maximum Operating Temperature: 100 Cel; Size: 5 mm; Configuration: SINGLE; Shape: ROUND;
KOM0622045
INFRARED LED; No. of LEDs in Array: 8; Maximum Forward Voltage: .8 V; Peak Wavelength (nm): 850; Color At Wavelength: INFRARED;
HSDL-4420-OPTION-031
Broadcom
INFRARED LED; Terminal Finish: Tin (Sn); Shape: ROUND; Size: 1.78 mm; Minimum Operating Temperature: -40 Cel; No. of Functions: 1;
TLN104(B,LB,F)
Toshiba
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Maximum Forward Voltage: 1.35 V; Spectral Bandwidth: 50 m; Maximum Reverse Voltage: 5 V; Maximum Operating Temperature: 85 Cel;
GL4800E0000F
Sharp Corporation
Sharp GL4800E0000F is a 0.8mm INFRARED LED with peak wavelength of 950nm. It has max forward current of 0.05A and nominal output power of 1.6W. Ideal for applications requiring IR illumination in temperature range -25 to 85°C.
15410285AA170
Wuerth Elektronik & Kg
Wurth Elektronik's 15410285AA170 is a SINGLE Infrared LED with 1.7mm size, emitting at 850nm peak wavelength. Ideal for applications requiring a viewing angle of 110°, it operates b/w -40 to 85 °C and has a max forward current of 0.07A.
OD8365DP
Renesas Electronics
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 60 Cel; Spectral Bandwidth: 140 m; Peak Wavelength (nm): 882;
TLN115A-B
INFRARED LED; No. of Functions: 1; Maximum Forward Current: .1 A; Maximum Operating Temperature: 75 Cel; Shape: ROUND; Nominal Output Power: 13 W;
OP233
Optek Technology
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Maximum Forward Current: .1 A; Nominal Output Power: 10 W; Spectral Bandwidth: 80 m; Maximum Operating Temperature: 125 Cel;
SE304
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Forward Voltage: 1.4 V; Spectral Bandwidth: 60 m;
SFH4715AS
The Osram Opto Semiconductors SFH4715AS is an infrared LED with a peak wavelength of 860nm. It has a max forward current of 1.5A and operates b/w -40°C to 125°C. Ideal for applications requiring high-power single infrared LEDs.
TSAL6100UL
Vishay Intertechnology
TSAL6100UL by Vishay Intertechnology is a 5mm infrared LED with a peak wavelength of 940nm. It has a max forward current of 0.1A and can operate at temperatures ranging from -40 to 85°C. This LED is commonly used in applications such as remote controls, security systems, and proximity sensors.
OD8366B
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Voltage: 1.5 V; JESD-609 Code: e0; Semiconductor Material: InGaAs;
HSM8-C190
INFRARED LED; Mounting Feature: SURFACE MOUNT; Packing Method: TR, 7 INCH; No. of Functions: 1; Maximum Forward Voltage: 1.8 V; Size: 1.1 mm;
TSSS2600
Vishay Telefunken
INFRARED LED; Terminal Finish: Tin/Silver (Sn/Ag); JESD-609 Code: e2; Minimum Operating Temperature: -55 Cel; Configuration: SINGLE; Maximum Operating Temperature: 100 Cel;
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TLN224
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Output Power: 14 W; Minimum Operating Temperature: -25 Cel; Peak Wavelength (nm): 870; Shape: ROUND;
TLN212
INFRARED LED; Minimum Operating Temperature: -25 Cel; Maximum Forward Current: .05 A; Nominal Output Power: 12 W; Maximum Operating Temperature: 60 Cel; Additional Features: SIDE VIEW;
TLN206
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Peak Wavelength (nm): 875; JESD-609 Code: e0; Viewing Angle: 52 deg;
TLN222
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); No. of Functions: 1; Shape: ROUND; Configuration: SINGLE; Maximum Forward Current: .1 A;
TLN216
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Peak Wavelength (nm): 875; Viewing Angle: 38 deg; JESD-609 Code: e0;
TLN210(F)
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Configuration: SINGLE; Shape: ROUND; Additional Features: SIDE VIEW; Size: 3.6 mm;
TLN225
INFRARED LED; Maximum Operating Temperature: 85 Cel; Maximum Forward Current: .1 A; Configuration: SINGLE; Nominal Output Power: 18 W; No. of Functions: 1;
TLN201(F)
INFRARED LED; Minimum Operating Temperature: -40 Cel; Nominal Output Power: 5 W; Maximum Operating Temperature: 125 Cel; Maximum Forward Current: .1 A; Size: 4.7 mm;
TLN212(F)
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Additional Features: SIDE VIEW; Maximum Reverse Voltage: 1 V; Maximum Forward Current: .05 A; Size: 3.6 mm;
TLN208
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Shape: ROUND; No. of Functions: 1; Configuration: SINGLE; Minimum Operating Temperature: -25 Cel;
TLN221
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Forward Current: .1 A; JESD-609 Code: e0; Minimum Operating Temperature: -25 Cel; Shape: ROUND;
TLN217
INFRARED LED; No. of Functions: 1; Shape: ROUND; Configuration: SINGLE; Peak Wavelength (nm): 870; Maximum Operating Temperature: 60 Cel;
TLN210
INFRARED LED; Maximum Forward Current: .05 A; Maximum Operating Temperature: 60 Cel; No. of Functions: 1; Nominal Output Power: 12 W; Minimum Operating Temperature: -25 Cel;
TLN223
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Configuration: SINGLE; Maximum Forward Current: .1 A; JESD-609 Code: e0; No. of Functions: 1;
TLN205
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Minimum Operating Temperature: -20 Cel; JESD-609 Code: e0; Maximum Operating Temperature: 75 Cel; Nominal Output Power: 10 W;
TLN211
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Shape: ROUND; Maximum Forward Current: .05 A; Configuration: SINGLE; Nominal Output Power: 12 W;
TLN201
INFRARED LED; No. of Functions: 1; Additional Features: HIGH RELIABILITY; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 125 Cel; Maximum Forward Current: .1 A;
TLN203
INFRARED LED; Nominal Output Power: 3.5 W; Maximum Forward Current: .05 A; Size: 3 mm; Minimum Operating Temperature: -20 Cel; Shape: ROUND;
TLN208(F)
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Voltage: 1 V; Minimum Operating Temperature: -25 Cel; Semiconductor Material: GaAlAs;
TLN217(F)
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Maximum Operating Temperature: 60 Cel; Shape: ROUND; Configuration: SINGLE; Peak Wavelength (nm): 870;
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