Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Minimum Operating Temperature: -25 Cel; Configuration: SINGLE; JESD-609 Code: e0; Maximum Operating Temperature: 85 Cel;
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Infrared LEDs TLN119-A attributes and parameters. Explore more Infrared LEDs devices from Toshiba
Configuration:
Maximum Forward Current:
JESD-609 Code:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optoelectronic Type:
Nominal Output Power:
Peak Wavelength (nm):
Shape:
Size:
Terminal Finish:
TLN119-A Optoelectronics trade compliance attributes, and parameters.
HTS
8541.40.20.00
SB
TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
EU2B-YS303C
Idec
ROTARY SWITCH;
Crimson Semiconductor
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
Hy Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1554216002
Molex
WIRE AND CABLE;
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Texas Instruments
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Nte Electronics
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
Rugao Dachang Electronic
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
SLR938C
Onsemi
SLR938C by Onsemi is an Infrared LED with peak wavelength of 945nm, forward current of 0.1A, and response time of 0.000001s. Ideal for applications requiring precise infrared illumination in a temperature range from -20 °C to 80°C.
ASDL-4671-C31
Broadcom
INFRARED LED; Terminal Finish: Matte Tin (Sn); Shape: ROUND; Size: 3 mm; Peak Wavelength (nm): 940; JESD-609 Code: e3;
SLR932AV8
SLR932AV8 by Onsemi is an Infrared LED with 0.1A forward current, 945nm peak wavelength, and 60° viewing angle. Ideal for applications requiring IR illumination in a temperature range of -25 °C to 80°C.
TIL24HR2
TIL24HR2 by Texas Instruments is an Infrared LED with peak wavelength of 940nm, forward current of 0.1A, and viewing angle of 35°. It operates b/w -65°C to 125°C, has a max reverse voltage of 2V, and uses GaAs as semiconductor material. Ideal for applications requiring precise infrared illumination in a through-hole mounting setup.
NDL5312P
Renesas Electronics
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Voltage: 2 V; Semiconductor Material: InGaAs; Maximum Forward Voltage: 2 V;
SFH477E7797
Infineon Technologies
INFRARED LED; Minimum Operating Temperature: -55 Cel; No. of Functions: 1; Configuration: SINGLE; Peak Wavelength (nm): 880; Nominal Output Power: 23 W;
TLN113-BC
Toshiba
INFRARED LED; Configuration: SINGLE; Peak Wavelength (nm): 940; Size: 3 mm; Minimum Operating Temperature: -20 Cel; Shape: ROUND;
OP233W
Optotek
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Configuration: SINGLE; Shape: CYLINDRICAL; Maximum Operating Temperature: 125 Cel; Semiconductor Material: GaAlAs;
ARE1-89D0-00000
INFRARED LED; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: -40 Cel; Packing Method: TR, 7 INCH; Shape: ROUND; Configuration: SINGLE WITH BUILT-IN ESD PROTECTION DEVICE;
TSAL4400-RSZ
INFRARED LED;
LD265
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); No. of LEDs in Array: 5; JESD-609 Code: e0; Color At Wavelength: INFRARED; Maximum Operating Temperature: 85 Cel;
Q65112A1517
Osram Opto Semiconductors
Osram Opto Semiconductors' Q65112A1517 is a 2.744mm IR LED with peak wavelength of 860nm, max forward current of 1.5A, and output power of 1340W. Ideal for applications requiring surface mount configuration, it operates b/w -40 to 125°C temperatures with a viewing angle of 25°.
LD261
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Viewing Angle: 58 deg; Minimum Operating Temperature: -40 Cel; Semiconductor Material: GaAs; Maximum Forward Current: .06 A;
HSDL-4420#011
Agilent Technologies
INFRARED LED; Mounting Feature: SURFACE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Voltage: 5 V; JESD-609 Code: e0; Maximum Forward Voltage: 1.7 V;
SFH4045N
Osram Opto Semiconductors' SFH4045N is an INFRARED LED with 0.07A max forward current, emitting at 950nm peak wavelength. Ideal for applications requiring a 40W nominal output power, such as remote controls and proximity sensors due to its 9° viewing angle and surface mount feature. Operating temperatures range from -40°C to 85°C.
F1047B
Infrared LEDs; Spectral Bandwidth: 100 m; Maximum Reverse Voltage: 5 V; Peak Wavelength (nm): 880; Minimum Operating Temperature: -40 Cel; Semiconductor Material: GaAlAs;
VSLB3940-MSZ
Vishay Intertechnology's VSLB3940-MSZ is a 3mm IR LED with peak wavelength of 940nm. It has max forward current of 0.1A and nominal output power of 40W. Ideal for applications requiring infrared illumination in temperatures ranging from -40°C to 85°C.
TSML1030
Vishay Telefunken
INFRARED LED; Terminal Finish: Tin (Sn); Additional Features: HIGH RELIABILITY; Minimum Operating Temperature: -40 Cel; JESD-609 Code: e3; Maximum Forward Current: .1 A;
ARE1-9FD0-00000
HLP30RC
INFRARED LED; No. of Functions: 1; Maximum Forward Current: .25 A; Maximum Operating Temperature: 40 Cel; Size: .6 mm; Peak Wavelength (nm): 840;
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TLN107A-A
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Shape: ROUND; Size: 1.5 mm; No. of Functions: 1; Maximum Forward Current: .05 A;
TLN104(B,LB,F)
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Maximum Forward Voltage: 1.35 V; Spectral Bandwidth: 50 m; Maximum Reverse Voltage: 5 V; Maximum Operating Temperature: 85 Cel;
TLN103
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Forward Current: .04 A; Peak Wavelength (nm): 950; Maximum Operating Temperature: 75 Cel;
TLN105B(F)
INFRARED LED; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Nominal Output Power: 11 W; Maximum Reverse Voltage: 5 V; Viewing Angle: 47 deg;
TLN104(LB)
INFRARED LED; Peak Wavelength (nm): 940; Maximum Operating Temperature: 85 Cel; Configuration: SINGLE; Size: 1.6 mm; Maximum Forward Current: .04 A;
TLN104(B,F)
Infrared LEDs; Mounting Feature: SURFACE MOUNT; Maximum Forward Current: .04 A; Peak Wavelength (nm): 940; Semiconductor Material: GaAs; Minimum Operating Temperature: -25 Cel;
TLN107A-B
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); No. of Functions: 1; JESD-609 Code: e0; Nominal Output Power: 2.5 W; Peak Wavelength (nm): 940;
TLN101A-C
INFRARED LED; Size: 4.675 mm; Shape: ROUND; Maximum Forward Current: .1 A; Nominal Output Power: 1.5 W; Additional Features: HIGH RELIABILITY;
TLN104(F)
Infrared LEDs; Mounting Feature: SURFACE MOUNT; Maximum Forward Voltage: 1.35 V; Maximum Reverse Voltage: 5 V; Maximum Operating Temperature: 85 Cel; Viewing Angle: 40 deg;
TLN103A
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); No. of Functions: 1; Peak Wavelength (nm): 940; Maximum Forward Current: .06 A; Maximum Operating Temperature: 75 Cel;
TLN105B
INFRARED LED; Size: 5 mm; Maximum Forward Current: .1 A; No. of Functions: 1; Minimum Operating Temperature: -25 Cel; Nominal Output Power: 11 W;
TLN104(LB,F)
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Peak Wavelength (nm): 940; Maximum Forward Current: .04 A; Maximum Reverse Voltage: 5 V; Maximum Forward Voltage: 1.35 V;
TLN104(B)
INFRARED LED; Minimum Operating Temperature: -25 Cel; Configuration: SINGLE; Maximum Forward Current: .04 A; Nominal Output Power: 2.5 W; Peak Wavelength (nm): 940;
TLN107A
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Size: 1.5 mm; Maximum Forward Current: .05 A; Configuration: SINGLE; Maximum Operating Temperature: 85 Cel;
TLN102(F)
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Forward Current: .1 A; Semiconductor Material: GaAs; Spectral Bandwidth: 50 m;
TLN104(B,LB)
INFRARED LED; No. of Functions: 1; Maximum Operating Temperature: 85 Cel; Maximum Forward Current: .04 A; Minimum Operating Temperature: -25 Cel; Peak Wavelength (nm): 940;
TLN101A
INFRARED LED; Additional Features: HIGH RELIABILITY; No. of Functions: 1; Size: 4.675 mm; Peak Wavelength (nm): 940; Nominal Output Power: 1.5 W;
TLN102
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Minimum Operating Temperature: -40 Cel; Size: 4.7 mm; Maximum Forward Current: .1 A; Peak Wavelength (nm): 940;
TLN104
INFRARED LED; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -25 Cel; JESD-609 Code: e0; Maximum Forward Current: .04 A;
TLN105A
Infrared LEDs; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Spectral Bandwidth: 50 m; Maximum Forward Current: .1 A; Maximum Forward Voltage: 1.5 V;
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