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THC63LVD103D-1TTB

Thine Electronics

THC63LVD103D-1TTB by Thine Electronics

LINE DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 46; Package Code: TQFP; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Line Drivers & Receivers THC63LVD103D-1TTB attributes and parameters. Explore more Line Drivers & Receivers devices from Thine Electronics

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

6

No. of Terminals:

46

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.2 V

Output Characteristics:

DIFFERENTIAL

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

.01 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Maximum Transmit Delay:

5 ns

Width:

10 mm

Manufacturer Highlights

Thine Electronics

THine Electronics is a fabless semiconductor manufacturer that plans, designs, and sells LSIs that are familiar with both analog and digital. In addition to the ability to create our own technology, our technology has gained a high degree of trust due to the know-how that we have accumulated by supporting many customers. Due to the high-speed interface and power control technology that are essential for high-definition televisions, etc., applications are expanding in familiar fields such as consumer life and business activities. By hiring new human resources, we will be able to provide products in a timely manner and enable the selection of the optimal manufacturing process. We will respond to the rapid changes in the market by leveraging the power of change unique to a fabless semiconductor manufacturer. . In cooperation with our alliance partners, we will accelerate and realize the creation of new added value centered on mixed-signal technology.

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