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XTR117AIDRBTG4

Texas Instruments

XTR117AIDRBTG4 by Texas Instruments

XTR117AIDRBTG4 by Texas Instruments is an 8-terminal IC with a nominal voltage of 24V, suitable for automotive applications. It operates b/w -40 to 125 °C and has a max supply current of 0.25mA. This small outline package with a square shape is surface mountable and features bipolar technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 20,080 parts In-Stock

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Vyrian

USA . 6,005 parts In-Stock

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Digiode

USA . 777 parts In-Stock

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Nova Conductors

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One Stop Electronics

USA . 1,475 parts In-Stock

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$0.500

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$0.500

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Ampacity Inc.

Singapore . 1,266 parts In-Stock

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$1.500

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Semicontronic

India . 308 parts In-Stock

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$4.500

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$4.388

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$4.365

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$4.500

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Advanced Electronics

New Zealand . 26 parts In-Stock

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$10.516

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$9.990

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$9.990

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$9.990

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AZTECH Wire

Italy . 244 parts In-Stock

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$13.959

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Corohmni

South Africa . 330 parts In-Stock

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$19.901

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$19.901

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Parana Technologies

USA . 723 parts In-Stock

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$20.862

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$1,937.316

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$18.775

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DigiPath Technology Company

USA . 2,046 parts In-Stock

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$22.971

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ChromeModa Solutions

Germany . 3,856 parts In-Stock

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IDEA Electronic Components Group

UK . 1,081 parts In-Stock

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$22.268

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$21.096

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Continental Prestige Electronics

USA . 3,529 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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Argo Parts USA

USA . 574 parts In-Stock

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iodParts Technologies Inc.

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Modulus Dynamics

Lithuania . 200 parts In-Stock

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Bastille Electronics

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Overview

Experience unmatched quality and reliability with the XTR117AIDRBTG4 by Texas Instruments. As a leading manufacturer in the semiconductor industry, Texas Instruments delivers cutting-edge solutions for various applications. This small outline, heat sink package offers a wide supply voltage range and operates in extreme temperatures, making it ideal for automotive use. With its advanced technology and dual terminal position, this analog circuit IC provides customers with superior performance, ensuring efficiency and precision in their projects. Upgrade your electronics with the XTR117AIDRBTG4 and enjoy unparalleled value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature of this product allows for easy and efficient assembly onto a circuit board, saving time and effort during the manufacturing process.

Package Shape: SQUARE

The square package shape of this product ensures a compact and space-saving design, making it suitable for applications with limited space constraints.

Nominal Supply Voltage (Vsup): 24 V

The 24V nominal supply voltage ensures compatibility with a wide range of systems and applications, providing flexibility and ease of integration.

Power Supplies (V): 24

With a power supply of 24V, this product offers reliable performance and stability, making it a dependable choice for various industrial applications.

No. of Terminals: 8

The 8 terminals provide enough connection points for interfacing with external components, offering versatility and expandability in design.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style of this product allows for efficient heat dissipation, ensuring optimal performance even in high-temperature environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables this product to withstand harsh operating conditions, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function effectively in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connection options, making this product versatile and easy to integrate into various systems.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a compact and streamlined design, making this product suitable for space-constrained applications.

Technical Specifications

Other Function Semiconductors XTR117AIDRBTG4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

7.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

XTR117AIDRBTG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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