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XTPS56637RPAR

Texas Instruments

XTPS56637RPAR by Texas Instruments

XTPS56637RPAR by Texas Instruments is a 10-terminal switching regulator with PWM control, operating at -40 to 125°C. It features a buck switcher configuration, 4.5-28V input range, and 500 kHz max frequency. Ideal for automotive applications due to its compact chip carrier package and high temperature grade.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,298 parts In-Stock

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Digiode

USA . 1,431 parts In-Stock

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Nova Conductors

Japan . 87 parts In-Stock

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One Stop Electronics

USA . 1,512 parts In-Stock

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$1.500

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$1.500

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Semicontronic

India . 961 parts In-Stock

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$4.500

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$4.388

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$4.365

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961

$4.500

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Ampacity Inc.

Singapore . 1,390 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 715 parts In-Stock

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$12.472

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Parana Technologies

USA . 1,160 parts In-Stock

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$18.509

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$18.620

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$19.509

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$18.534

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$18.534

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DigiPath Technology Company

USA . 2,192 parts In-Stock

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$20.381

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$18.751

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$20.381

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ChromeModa Solutions

Germany . 724 parts In-Stock

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$20.797

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$17.054

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IDEA Electronic Components Group

UK . 505 parts In-Stock

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$20.797

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$19.757

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$18.717

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505

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Corohmni

South Africa . 856 parts In-Stock

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$21.247

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Continental Prestige Electronics

USA . 5,248 parts In-Stock

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Argo Parts USA

USA . 2,902 parts In-Stock

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Corphita

USA . 2,711 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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$1.211

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Bastille Electronics

Australia . 56 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XTPS56637RPAR by Texas Instruments. With a reputation for excellence in manufacturing, this switching regulator offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides customers with superior quality, efficiency, and flexibility. Experience the benefits of advanced control techniques and innovative design, maximizing value and enhancing your projects like never before. Elevate your electronic designs with the XTPS56637RPAR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

The plastic/epoxy package body material is durable and lightweight, making the product suitable for various applications.

Surface Mount - YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and facilitating mass production.

Maximum Operating Temperature - 125 °C

With a high maximum operating temperature of 125°C, this product can withstand demanding and high-temperature environments without sacrificing performance.

Minimum Operating Temperature - -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extremely cold conditions, making it suitable for a wide range of applications.

Maximum Switching Frequency - 500 kHz

The high maximum switching frequency of 500 kHz allows for efficient regulation and control of the power output, ensuring stable and precise operation.

Technical Specifications

Switching Regulators & Controllers XTPS56637RPAR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

OUTPUT VOLTAGE= 0.6V TO 16V

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-PQCC-N10

Length:

3 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

XTPS56637RPAR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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