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XRM57L843ZWTT

Texas Instruments

XRM57L843ZWTT by Texas Instruments

XRM57L843ZWTT by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, 128K data EEPROM size, and 41-Ch 12-Bit ADC channels. Ideal for industrial applications requiring CAN, ETHERNET, I2C, SPI, and UART connectivity with a max clock frequency of 80 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,070 parts In-Stock

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Digiode

USA . 4,223 parts In-Stock

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4,223

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Chip Stock

USA . 135 parts In-Stock

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135

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One Stop Electronics

USA . 412 parts In-Stock

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$8.000

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412

$8.000

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Semicontronic

India . 965 parts In-Stock

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$12.000

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$11.700

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$11.640

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965

$12.000

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AZTECH Wire

Italy . 894 parts In-Stock

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$12.426

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Parana Technologies

USA . 2,132 parts In-Stock

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$18.075

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$18.221

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$18.075

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ChromeModa Solutions

Germany . 3,198 parts In-Stock

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$20.309

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$16.653

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IDEA Electronic Components Group

UK . 942 parts In-Stock

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$20.309

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$19.294

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$18.278

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942

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Component Stockers USA

USA . 533 parts In-Stock

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$99.990

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$99.990

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DigiPath Technology Company

USA . 1,502 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock the power of innovation with the XRM57L843ZWTT microcontroller by Texas Instruments. Designed with cutting-edge technology, this device offers a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. Delivering high performance and reliability, Texas Instruments ensures top-notch quality and value for customers. Experience seamless connectivity and advanced features, making the XRM57L843ZWTT the perfect choice for your next project. Say hello to limitless possibilities with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage tolerance provides flexibility in power supply options and ensures stable operation.

Address Bus Width: 22

A wide address bus width enables efficient memory addressing and data processing capabilities.

Package Shape: SQUARE

Square package shape offers a compact design, optimizing board space and enhancing integration possibilities.

Bit Size: 32

32-bit architecture allows for high-performance computing and data processing capabilities.

No. of Terminals: 337

High number of terminals provide ample connectivity options for interfacing external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers high density integration while minimizing footprint on the PCB.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures operational reliability in extreme cold environments.

ADC Channels: YES

Built-in analog-to-digital converter channels facilitate accurate and efficient conversion of analog signals.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between memory and peripherals without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enhances heat dissipation capabilities.

ROM Words: 4194304

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.4 mm

Low seated height enables compact system design and reduces overall product profile.

Width: 16 mm

Compact width dimension offers space-saving benefits and enhances versatility in board layout.

Data EEPROM Size: 128K

Generous EEPROM size provides ample non-volatile data storage capacity for critical system information.

External Data Bus Width: 16

Wide external data bus width facilitates high-speed data transfer between the microcontroller and external devices.

Peripherals: DMA(32), POR, PWM(7), TIMER(65), WDT

Rich set of peripherals including DMA, POR, PWM, TIMER, and WDT enhance the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 80 MHz

High maximum clock frequency allows for fast data processing and efficient execution of instructions.

Length: 16 mm

Compact length dimension enables space-saving integration in various electronic devices and systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high performance, power efficiency, and scalability for diverse applications.

RAM Bytes: 524288

Large RAM capacity enables efficient data storage and processing, enhancing system performance.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation for various electronic applications.

Terminal Form: BALL

Ball terminal form offers reliable electrical connections and facilitates easy soldering during PCB assembly.

Analog To Digital Convertors: 41-Ch 12-Bit

High-resolution analog-to-digital converters with multiple channels support accurate and precise conversion of analog signals.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog output signals and motor speed regulation.

Connectivity: CAN(4), ETHERNET, I2C(2), SPI(5), UART(4)

Versatile connectivity options including CAN, Ethernet, I2C, SPI, and UART facilitate seamless integration with various communication interfaces and devices.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible firmware updates and modifications for optimal system performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch provides high-density connection capabilities and enhances reliability in PCB assembly.

Speed: 330 rpm

High processing speed of 330 rpm enables fast data processing and efficient execution of real-time tasks.

On Chip Program ROM Width: 8

On-chip program ROM with a width of 8 allows for storing essential program instructions for seamless system operation.

No. of I/O Lines: 145

Abundance of I/O lines provides versatile interfacing options for connecting external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers XRM57L843ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

Length:

16 mm

No. of I/O Lines:

145

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

524288

ROM Words:

4194304

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

330 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(4), ETHERNET, I2C(2), SPI(5), UART(4)

Peripherals:

DMA(32), POR, PWM(7), TIMER(65), WDT

Analog To Digital Convertors:

41-Ch 12-Bit

Trade Compliance

XRM57L843ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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