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XLMG1020YFFT

Texas Instruments

XLMG1020YFFT by Texas Instruments

XLMG1020YFFT by Texas Instruments is a peripheral driver with 6 terminals, operating voltage range of 4.75V to 5.25V, and temperature grade suitable for automotive applications. It features built-in under voltage protection, source/sink output current flow direction, and a compact rectangular package shape ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,804 parts In-Stock

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Digiode

USA . 863 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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One Stop Electronics

USA . 1,333 parts In-Stock

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$1.500

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$1.500

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Corohmni

South Africa . 374 parts In-Stock

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$8.186

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374

$8.186

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AZTECH Wire

Italy . 481 parts In-Stock

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$11.290

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Semicontronic

India . 637 parts In-Stock

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$11.500

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$11.212

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$11.155

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637

$11.500

$11.212

$11.155

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Parana Technologies

USA . 887 parts In-Stock

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$12.229

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$12.652

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$12.229

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$12.652

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Ampacity Inc.

Singapore . 935 parts In-Stock

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$12.500

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DigiPath Technology Company

USA . 1,739 parts In-Stock

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$13.466

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$12.389

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ChromeModa Solutions

Germany . 5,920 parts In-Stock

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$13.741

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$11.268

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IDEA Electronic Components Group

UK . 751 parts In-Stock

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$13.741

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$13.054

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$12.367

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751

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Perfect Parts

USA . 10,080 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,567 parts In-Stock

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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Argo Parts USA

USA . 3,712 parts In-Stock

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Corphita

USA . 2,672 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your electronic designs with the XLMG1020YFFT by Texas Instruments, a top-tier manufacturer known for quality and innovation. As a peripheral driver in a compact grid array package, this product offers under voltage protection and source/sink output current flow direction. Ideal for automotive applications, this peripheral driver ensures reliable performance even in harsh conditions. Trust Texas Instruments to deliver unmatched value and benefits, providing you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, making this peripheral driver a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable makes installation easier and allows for compact design, making it suitable for applications where space is limited.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of input voltages, providing versatility in different applications.

Built-in Protections: UNDER VOLTAGE

The under voltage protection feature helps safeguard the peripheral driver and connected devices from damage due to low supply voltage, ensuring reliable operation.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this peripheral driver is built to withstand harsh environmental conditions and is suitable for use in vehicles.

Output Current Flow Direction: SOURCE AND SINK

Supporting both source and sink current flow directions allows for flexibility in connecting various components, making this peripheral driver versatile for different circuit configurations.

Technical Specifications

Peripheral Drivers XLMG1020YFFT attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

UNDER VOLTAGE

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.255 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.855 mm

Trade Compliance

XLMG1020YFFT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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