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XCC1352R1F3RGZR

Texas Instruments

XCC1352R1F3RGZR by Texas Instruments

XCC1352R1F3RGZR by Texas Instruments is a microcontroller with 48 terminals and a square package. It operates at temperatures ranging from -40 to 85 °C and has ADC and DMA channels. It is commonly used in industrial applications for its connectivity options such as I2C, I2S, SSI, and UART.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 4,746 parts In-Stock

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Vyrian

USA . 3,551 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 503 parts In-Stock

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$5.340

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One Stop Electronics

USA . 1,560 parts In-Stock

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$7.000

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Semicontronic

India . 516 parts In-Stock

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$9.750

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$9.700

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Ampacity Inc.

Singapore . 1,457 parts In-Stock

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Corohmni

South Africa . 1,055 parts In-Stock

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$54.419

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Parana Technologies

USA . 629 parts In-Stock

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DigiPath Technology Company

USA . 2,017 parts In-Stock

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$63.085

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ChromeModa Solutions

Germany . 3,997 parts In-Stock

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$57.375

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IDEA Electronic Components Group

UK . 1,606 parts In-Stock

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$66.472

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$62.973

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Continental Prestige Electronics

USA . 4,840 parts In-Stock

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Argo Parts USA

USA . 4,762 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Experience the next level of performance and versatility with the XCC1352R1F3RGZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments is renowned for delivering top-quality microcontrollers that exceed expectations. The XCC1352R1F3RGZR offers a multitude of applications, making it an essential component for any project. With its advanced features and cutting-edge technology, this microcontroller provides unmatched value and benefits. From its sleek design to its impressive functionality, this product is the ultimate solution for your needs. Discover the advantages of the XCC1352R1F3RGZR and unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

With surface mount capability, this microcontroller can be easily integrated into circuit boards, saving space and enabling efficient PCB manufacturing.

Maximum Supply Voltage: 3.8 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of voltage sources.

Package Shape: SQUARE

The square package shape makes it easier to handle and mount the microcontroller, simplifying the assembly process and ensuring proper alignment.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample connectivity options for various peripheral devices, enabling versatile integration possibilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style combined with a heat sink/slug and a very thin profile enhances thermal management, ensuring optimal performance even in demanding applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for power-efficient operation, making this microcontroller suitable for battery-powered applications and energy-saving designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable operation even in harsh environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller can withstand extremely cold conditions, expanding its range of applications.

ADC Channels: YES

The availability of analog-to-digital converter (ADC) channels enables the microcontroller to interface with analog sensors and signals, broadening its capabilities for data acquisition and measurement applications.

DMA Channels: YES

The presence of DMA channels allows for direct memory access, enabling efficient data transfers between peripherals and memory, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and routing, making the microcontroller integration more straightforward and reducing the risk of signal interference.

ROM Words: 360448

With a large ROM capacity of 360448 words, this microcontroller can store extensive program code, facilitating the development of complex applications.

Maximum Seated Height: 1 mm

The low maximum seated height ensures the microcontroller can be integrated into compact designs and supports the miniaturization of electronic devices.

Width: 7 mm

The narrow width of the microcontroller allows for space-efficient placement on PCBs, enabling compact system designs.

Peripherals: BOD, COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT

The inclusion of various peripherals such as Brown-Out Detector (BOD), comparators, DMA channels, Power-On Reset (POR), Real-Time Clock (RTC), timers, and Watchdog Timer (WDT) enhances the microcontroller's functionality, enabling it to perform a wide range of tasks and meet diverse application requirements.

Maximum Time At Peak Reflow Temperature (s): 30

This microcontroller can withstand peak reflow temperatures for up to 30 seconds during the manufacturing process, ensuring reliable solder connections and robust operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C allows for compatibility with lead-free solder processes, meeting industry standards and regulations.

Length: 7 mm

The compact length of the microcontroller enables efficient space utilization on PCBs and supports miniaturized designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller operates reliably in challenging environmental conditions, demonstrating robustness and high performance.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller's RISC architecture enhances its processing speed, efficiency, and compatibility with various software development tools, making it an excellent choice for advanced applications.

RAM Bytes: 81920

With a generous RAM capacity of 81920 bytes, this microcontroller can efficiently handle data storage and manipulation, enabling the execution of complex algorithms and multitasking.

Technology: CMOS

The Complementary Metal-Oxide-Semiconductor (CMOS) technology used in this microcontroller provides low power consumption, high noise immunity, and compatibility with a wide range of system components.

Terminal Form: NO LEAD

The no lead terminal form, such as solder balls or pads, simplifies the surface mount process, reducing assembly time and ensuring a reliable electrical connection.

Analog to Digital Convertors: 8-Ch 12-Bit

Equipped with 8 channels of 12-bit analog-to-digital converters, this microcontroller enables precise conversion of analog signals into digital data, making it ideal for sensor-based applications and measurement systems.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V provides compatibility with standard power sources, simplifies power management, and supports easy integration into existing systems.

PWM Channels: YES

The availability of pulse-width modulation (PWM) channels allows the microcontroller to control analog outputs, facilitating motor control, LED dimming, and other applications requiring precise power modulation.

Connectivity: I2C, I2S, SSI(2), UART(2)

With support for I2C, I2S, SSI, and UART communication protocols, this microcontroller offers versatile connectivity options, enabling seamless integration with various devices and communication networks.

ROM Programmability: FLASH

The use of flash memory as ROM allows for easy and flexible programming of the microcontroller, facilitating firmware updates and customization without the need for external programming equipment.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm ensures compatibility with modern PCB manufacturing processes, supporting high-density circuit designs and enabling miniaturized product form factors.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller requires standard handling precautions during assembly, ensuring reliable performance and preventing damage caused by moisture exposure.

Speed: 48 rpm

The processing speed of 48 revolutions per minute allows the microcontroller to execute instructions quickly, enabling efficient data processing and response times in real-time applications.

On Chip Program ROM Width: 8

The program ROM width of 8 bits supports efficient and compact code storage, contributing to the microcontroller's enhanced performance and reduced memory usage.

No. of I/O Lines: 28

With 28 input/output lines, this microcontroller offers ample connectivity options for interfacing with external devices and sensors, providing flexibility in system design and integration.

Technical Specifications

Microcontrollers XCC1352R1F3RGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

32.768KHZ NOMINAL CRYSTAL CLOCK AVAILABLE

Address Bus Width:

0

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

81920

ROM Words:

360448

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C, I2S, SSI(2), UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

XCC1352R1F3RGZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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