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X4MF03107SPZQQ1

Texas Instruments

X4MF03107SPZQQ1 by Texas Instruments

X4MF03107SPZQQ1 by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at up to 20 MHz. Designed for automotive applications, it features AEC-Q100 screening and operates b/w -40°C to 125°C. With a low profile flatpack package style, this CMOS technology-based microcontroller offers flash ROM programmability and 49 I/O lines for versatile usage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,997 parts In-Stock

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8,997

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Digiode

USA . 252 parts In-Stock

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252

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Distributors (Availability)

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AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$6.012

100+ parts

-

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286

$6.012

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One Stop Electronics

USA . 528 parts In-Stock

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$23.000

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528

$23.000

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Parana Technologies

USA . 2,334 parts In-Stock

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$75.365

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2,334

$75.365

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ChromeModa Solutions

Germany . 6,704 parts In-Stock

1+ parts

$84.680

100+ parts

$69.438

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6,704

$84.680

$69.438

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IDEA Electronic Components Group

UK . 1,689 parts In-Stock

1+ parts

$84.680

100+ parts

$80.446

1k+ parts

$76.212

10k+ parts

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1,689

$84.680

$80.446

$76.212

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Microchip USA

USA . 2,681 parts In-Stock

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2,681

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Corphita

USA . 2,362 parts In-Stock

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2,362

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DigiPath Technology Company

USA . 341 parts In-Stock

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$76.347

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341

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$76.347

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Overview

Elevate your automotive electronics with the X4MF03107SPZQQ1 by Texas Instruments. Crafted with precision and expertise, this microcontroller offers cutting-edge technology for a wide range of applications. Experience seamless performance and reliability with its CMOS technology and Flash ROM programmability. From its compact design to its high clock frequency, this product delivers unparalleled value and efficiency. Trust Texas Instruments to provide you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Allows for easy and efficient PCB assembly process.

Screening Level: AEC-Q100

Ensures high reliability and quality standards suitable for automotive applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

Bit Size: 32

Offers a good balance between performance and cost for many applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external components.

Maximum Operating Temperature: 125 °C

Suitable for automotive and industrial applications where high temperature operation is required.

Minimum Operating Temperature: -40 °C

Operates reliably in cold environments as well.

ADC Channels: YES

Integrated ADC channels enable analog input functionalities.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals on the PCB.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact product designs.

Width: 14 mm

Compact width enables space-efficient PCB layout.

Maximum Clock Frequency: 20 MHz

Offers good processing speed for a range of applications.

Length: 14 mm

Compact length allows for space-efficient product designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature operation and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing power for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections on the PCB.

Nominal Supply Voltage: 1.5 V

Low supply voltage for energy-efficient operation.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density PCB layouts.

Speed: 80 rpm

Offers fast processing speed for real-time applications.

No. of I/O Lines: 49

Provides a good number of input/output lines for interfacing with external devices.

Technical Specifications

Microcontrollers X4MF03107SPZQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

X4MF03107SPZQQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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