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VFC32SM

Texas Instruments

VFC32SM by Texas Instruments

VFC32SM by Texas Instruments is a voltage to frequency converter with 0.05% linearity error, operating at up to 0.5 MHz frequency. It has a max supply voltage of 20V and operates in temperatures ranging from -55°C to 125°C. Ideal for military-grade applications requiring precise analog signal conversion within a cylindrical package body material.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 8,821 parts In-Stock

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Digiode

USA . 3,178 parts In-Stock

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Holdelec - ElecDif-Pro

France . 8 parts In-Stock

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NAC Semi

USA . 4 parts In-Stock

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Zilex Electronics Inc.

Canada . 3 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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Resion

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Parana Technologies

USA . 2,129 parts In-Stock

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$5.949

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$6.729

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DigiPath Technology Company

USA . 1,329 parts In-Stock

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$6.550

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$6.026

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ChromeModa Solutions

Germany . 5,132 parts In-Stock

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$6.684

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IDEA Electronic Components Group

UK . 854 parts In-Stock

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$6.016

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854

$6.684

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AZTECH Wire

Italy . 537 parts In-Stock

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$12.806

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One Stop Electronics

USA . 1,945 parts In-Stock

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Corphita

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Overview

Elevate your analog signal processing with the VFC32SM by Texas Instruments. Designed with precision and reliability in mind, this voltage to frequency converter offers unmatched performance for a wide range of applications. From industrial automation to aerospace, this converter delivers accurate results with a minimal linearity error of only 0.05%. With a robust construction and a temperature grade of MILITARY, trust in the quality and durability of Texas Instruments' VFC32SM to meet your most demanding needs. Experience the superior value and benefits that this product brings to your projects today.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides durability and protection for the internal components, making the product suitable for rugged environments.

Maximum Supply Voltage: 20 V

The high maximum supply voltage allows for flexibility in power input options, accommodating a wide range of applications.

Package Shape: ROUND

The round package shape allows for easy integration and installation in various systems.

Maximum Linearity Error (EL): 0.05%

The low linearity error ensures accurate conversion of voltage to frequency, making this product reliable for precise measurements.

Power Supplies (V): +/-15

Dual power supply capability (+/-15V) provides stable and balanced power to the converter for consistent performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the converter to function effectively in various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables the converter to operate in extreme cold conditions without performance degradation.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability and durability in harsh environments typically encountered in military applications.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in voltage to frequency conversion, making this product ideal for critical measurement tasks.

Maximum Operating Frequency: 0.5 MHz

Higher operating frequency allows for faster data processing and response time, making the converter suitable for real-time applications.

Technical Specifications

Analog Special Purpose Converters VFC32SM attributes and parameters. Explore more Analog Special Purpose Converters devices from Texas Instruments

Converter Specifications

Technology:

Bipolar

Maximum Operating Frequency:

500 kHz

Maximum Linearity Error (EL):

0.05 %

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Power Supplies:

±15 V

Minimum Negative Supply Voltage:

-11 V

Nominal Negative Supply Voltage:

-15 V

Maximum Negative Supply Voltage:

-20 V

Maximum Supply Current:

6 mA

Maximum Negative Input Voltage:

-10 V

Minimum Supply Voltage:

11 V

Maximum Supply Voltage:

20 V

Operating Conditions

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temperature Grade:

Form Factor

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

10

Surface Mount:

No

Packaging

Package Body Material:

Metal

Package Shape:

Package Style:

Cylindrical

Package Code:

Package Equivalence Code:

CAN10,.23

Standards and Codes

Qualification:

Not Qualified

JESD-30 Code:

O-MBCY-W10

Trade Compliance

VFC32SM Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-087-7185, 5962010877185

NIIN

010877185

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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