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V62/21610-01XE

Texas Instruments

V62/21610-01XE by Texas Instruments

V62/21610-01XE by Texas Instruments is a small outline, shrink pitch interface IC with 4 functions and 16 terminals. It operates b/w -55 to 125 °C, suitable for military-grade applications. With a supply voltage range of 2.25V to 5.5V, it offers high reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,129 parts In-Stock

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6,129

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Digiode

USA . 4,759 parts In-Stock

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4,759

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,019 parts In-Stock

1+ parts

$3.500

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1,019

$3.500

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Parana Technologies

USA . 2,184 parts In-Stock

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$3.888

100+ parts

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$4.367

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2,184

$3.888

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$4.367

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DigiPath Technology Company

USA . 110 parts In-Stock

1+ parts

$4.282

100+ parts

$3.939

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110

$4.282

$3.939

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ChromeModa Solutions

Germany . 4,839 parts In-Stock

1+ parts

$4.369

100+ parts

$3.583

1k+ parts

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4,839

$4.369

$3.583

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IDEA Electronic Components Group

UK . 649 parts In-Stock

1+ parts

$4.369

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$3.932

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649

$4.369

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$3.932

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AZTECH Wire

Italy . 407 parts In-Stock

1+ parts

$17.536

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407

$17.536

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Corphita

USA . 1,060 parts In-Stock

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1,060

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Overview

Unleash the power of cutting-edge technology with the V62/21610-01XE by Texas Instruments. Designed to deliver unparalleled performance and reliability, this innovative product is perfect for a wide range of applications in the Other Function Interface ICs category. With a focus on quality and precision, Texas Instruments ensures that each component meets the highest standards, guaranteeing unmatched value and benefits for customers. Experience seamless integration, enhanced functionality, and superior efficiency with the V62/21610-01XE - your ultimate solution for all your interface circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount feature makes it easy to integrate and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for versatile applications.

No. of Functions: 4

Having 4 functions in one IC provides multiple capabilities in a single package.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in demanding conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality in extreme cold environments.

Temperature Grade: MILITARY

Military grade temperature tolerance ensures reliability in harsh environments.

Technical Specifications

Other Function Interface ICs V62/21610-01XE attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Total Dose (V):

30k Rad(Si)

Width:

3.895 mm

Trade Compliance

V62/21610-01XE Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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