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V62/11619-01XE

Texas Instruments

V62/11619-01XE by Texas Instruments

V62/11619-01XE by Texas Instruments is an adjustable negative single output LDO regulator with a max output voltage of 35V and a max dropout voltage of 0.6V. It operates in temperatures ranging from -55°C to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,639 parts In-Stock

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Digiode

USA . 3,106 parts In-Stock

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3,106

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,347 parts In-Stock

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$5.500

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1,347

$5.500

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Parana Technologies

USA . 1,480 parts In-Stock

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$7.160

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$7.669

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1,480

$7.160

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$7.669

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One Stop Electronics

USA . 1,482 parts In-Stock

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$7.500

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$7.500

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DigiPath Technology Company

USA . 1,462 parts In-Stock

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$7.884

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$7.253

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1,462

$7.884

$7.253

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IDEA Electronic Components Group

UK . 1,859 parts In-Stock

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$8.045

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$7.240

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1,859

$8.045

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$7.240

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ChromeModa Solutions

Germany . 1,309 parts In-Stock

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$8.045

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$6.597

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$8.045

$6.597

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Semicontronic

India . 1,236 parts In-Stock

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$8.500

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$8.288

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$8.245

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1,236

$8.500

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$8.245

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AZTECH Wire

Italy . 520 parts In-Stock

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$12.850

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520

$12.850

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Corphita

USA . 2,558 parts In-Stock

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Kepictronics

USA . 1,220 parts In-Stock

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Corohmni

South Africa . 434 parts In-Stock

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Overview

Experience superior performance and reliability with the Texas Instruments V62/11619-01XE Adjustable Regulator. Crafted by a trusted manufacturer, this negative single output LDO regulator offers unparalleled quality and precision. Ideal for a wide range of applications, this product delivers efficient power management with minimal dropout voltage. Say goodbye to voltage fluctuations and hello to consistent, stable power supply for your devices. Upgrade to the V62/11619-01XE today and enjoy seamless operation and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the regulator, ensuring a longer lifespan.

Maximum Dropout Voltage-1: 1.6V

The low dropout voltage allows for efficient regulation of the output voltage, minimizing power loss and improving overall performance.

Surface Mount: YES

The surface mount capability makes installation easy and saves space on the circuit board, ideal for compact designs.

Operating Temperature (TJ-Max): 125 °C

The wide operating temperature range allows the regulator to function reliably in various environments, making it versatile and adaptable.

Technology: BIPOLAR

Bipolar technology provides stable and accurate voltage regulation, ensuring consistent output performance.

Package Shape: SQUARE

The square shape of the package allows for efficient placement on the circuit board, optimizing space utilization.

Terminal Form: GULL WING

The gull wing terminal form simplifies the installation process and ensures secure connections, improving overall reliability.

Operating Temperature (TJ-Min): -55 °C

The low minimum operating temperature allows the regulator to function in harsh cold conditions, expanding its potential applications.

Technical Specifications

Adjustable Regulators - Negative Single Output LDO V62/11619-01XE attributes and parameters. Explore more Adjustable Regulators - Negative Single Output LDO devices from Texas Instruments

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.216 V

Maximum Input Voltage:

3 V

Minimum Input Voltage:

36 V

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

35 V

Minimum Output Voltage-1:

1.18 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

3 mm

Trade Compliance

V62/11619-01XE Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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