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UCC39002EVM

Texas Instruments

UCC39002EVM by Texas Instruments

UCC39002EVM by Texas Instruments is a Power Management Evaluation Board for ORing Controller/Load Share function. It comes in Bulk packaging and includes the UCC39002 IC. Ideal for testing power management solutions, this board is designed for Development and Demonstration applications.

Median Price

$118.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23 parts In-Stock

1+ parts

$99.000

100+ parts

-

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23

$99.000

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DigiKey

USA . 2 parts In-Stock

1+ parts

$118.800

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2

$118.800

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Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$119.170

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6

$119.170

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,965 parts In-Stock

1+ parts

$94.050

100+ parts

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4,965

$94.050

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Vyrian

USA . 4,713 parts In-Stock

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4,713

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$84.150

100+ parts

-

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10

$84.150

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Semicontronic

India . 10 parts In-Stock

1+ parts

$84.150

100+ parts

$82.046

1k+ parts

$81.626

10k+ parts

-

10

$84.150

$82.046

$81.626

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Corphita

USA . 1,808 parts In-Stock

1+ parts

$89.100

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1,808

$89.100

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Corohmni

South Africa . 431 parts In-Stock

1+ parts

$99.000

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431

$99.000

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ChromeModa Solutions

Germany . 3,658 parts In-Stock

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3,658

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

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1,328

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Parana Technologies

USA . 1,256 parts In-Stock

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$0.556

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1,256

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$0.556

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DigiPath Technology Company

USA . 589 parts In-Stock

1+ parts

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589

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Overview

Discover the UCC39002EVM by Texas Instruments, a high-quality power management evaluation board designed for ORing control and load sharing applications. With Texas Instruments' reputation for excellence in the industry, this development board provides unmatched performance and reliability. Ideal for a wide range of applications, the UCC39002EVM offers customers valuable benefits such as efficient power management and seamless load sharing capabilities, making it an essential tool for any project requiring precise control and distribution of power.

Feature Benefit Bullets

Other Names - 296-19045-ND

Easy to identify and order the product through alternate names.

Category - Development Boards, Kits, Programmers

Designed for use in various development and programming projects.

Package - Bulk

Convenient packaging for buying in bulk quantities.

Type - Power Management

Ideal for managing power in electronic devices or systems.

Function - ORing Controller / Load Share

Offers a function to control ORing and load sharing capabilities.

Utilized IC / Part - UCC39002

Utilizes high-quality and reliable UCC39002 IC/part for performance.

Supplied Contents - Board(s)

Includes necessary board(s) for immediate use in projects.

Base Product Number - UCC39002

Base product number for easy reference and compatibility.

Moisture Sensitivity Level (MSL) - 1 (Unlimited)

High MSL level ensures resistance to moisture damage for longevity.

Technical Specifications

Additional Parts UCC39002EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

-296-19045-ND
296-19045
296-19045-NDR
-UCC39002EVM-NDR
-296-19045

Function:

ORing Controller / Load Share

Type:

Power Management

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

UCC39002

Package:

Bulk

Standard Package:

1

Base Product Number:

UCC39002

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

UCC39002EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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