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UCC3895QG3

Texas Instruments

UCC3895QG3 by Texas Instruments

UCC3895QG3 by Texas Instruments is a switching controller with voltage-mode control technique. It operates b/w 0 to 70°C, suitable for commercial applications. With a max output current of 0.1A and a max switching frequency of 1000kHz, it is ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,089 parts In-Stock

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Digiode

USA . 1,503 parts In-Stock

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1,503

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Distributors (Availability)

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Semicontronic

India . 1,153 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

1,153

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 1,151 parts In-Stock

1+ parts

$4.500

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$4.500

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One Stop Electronics

USA . 174 parts In-Stock

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$6.500

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174

$6.500

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Parana Technologies

USA . 2,309 parts In-Stock

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$6.959

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$7.539

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2,309

$6.959

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$7.539

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DigiPath Technology Company

USA . 1,896 parts In-Stock

1+ parts

$7.663

100+ parts

$7.050

1k+ parts

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1,896

$7.663

$7.050

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ChromeModa Solutions

Germany . 2,775 parts In-Stock

1+ parts

$7.819

100+ parts

$6.412

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2,775

$7.819

$6.412

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IDEA Electronic Components Group

UK . 1,783 parts In-Stock

1+ parts

$7.819

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$7.037

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1,783

$7.819

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$7.037

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AZTECH Wire

Italy . 534 parts In-Stock

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$11.476

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534

$11.476

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Corphita

USA . 4,555 parts In-Stock

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4,555

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Microchip USA

USA . 466 parts In-Stock

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Corohmni

South Africa . 221 parts In-Stock

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Overview

Enhance your power management solutions with the UCC3895QG3 by Texas Instruments. As a trusted manufacturer in the industry of Switching Regulators & Controllers, Texas Instruments delivers top-notch quality and reliability. The UCC3895QG3 offers exceptional value with its versatile applications, precise voltage control, and efficient pulse width modulation technology. Experience seamless performance and peace of mind knowing you have a cutting-edge product at your disposal. Elevate your projects with the UCC3895QG3 and harness the power of innovation today.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic package material provides good insulation and protection for the internal components, extending the product's lifespan.

Surface Mount - YES

Surface mount technology allows for easy integration onto PCBs, saving space and reducing assembly time.

No. of Terminals - 20

Having a higher number of terminals allows for more flexible and versatile connections in the circuit.

Maximum Operating Temperature - 70 °C

High maximum operating temperature ensures the product can function reliably in various environments.

Nominal Input Voltage - 12 V

The specified input voltage range is suitable for a wide range of applications, making it a versatile choice.

Control Technique - PULSE WIDTH MODULATION

PWM control technique provides efficient and accurate voltage regulation, ensuring stable performance.

Technical Specifications

Switching Regulators & Controllers UCC3895QG3 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN CURRENT MODE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16.5 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

1000 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8.965 mm

Trade Compliance

UCC3895QG3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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