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UCC383TDTR-ADJG3

Texas Instruments

UCC383TDTR-ADJG3 by Texas Instruments

UCC383TDTR-ADJG3 by Texas Instruments is an adjustable positive single output LDO regulator with a max output current of 3A and a min input voltage of 2.8V. Operating temperature ranges from -55 to 150°C, making it suitable for various applications in electronics requiring precise voltage regulation. Its small outline package and gull wing terminals enhance its surface mount capabilities, ideal for compact designs where space is limited.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,429 parts In-Stock

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Digiode

USA . 1,285 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 463 parts In-Stock

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Bristol Electronics

USA . 201 parts In-Stock

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Parana Technologies

USA . 1,387 parts In-Stock

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$5.753

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$6.547

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$5.753

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$6.547

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DigiPath Technology Company

USA . 665 parts In-Stock

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$6.335

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$5.828

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665

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IDEA Electronic Components Group

UK . 1,884 parts In-Stock

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$6.464

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$5.818

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$6.464

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ChromeModa Solutions

Germany . 1,736 parts In-Stock

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$6.464

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$5.300

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AZTECH Wire

Italy . 513 parts In-Stock

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$14.972

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One Stop Electronics

USA . 814 parts In-Stock

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$19.500

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Microchip USA

USA . 2,899 parts In-Stock

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Corphita

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 463 parts In-Stock

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Glotronic Ltd.

UK . 370 parts In-Stock

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Overview

Looking for a reliable and efficient adjustable regulator? Look no further than the UCC383TDTR-ADJG3 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional performance in the field of adjustable regulators. Perfect for a wide range of applications, this LDO regulator offers customers value through its precise output control, low dropout voltage, and excellent load regulation. Trust Texas Instruments to provide you with the best-in-class solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and reliability for the product, making it suitable for various applications.

Maximum Dropout Voltage: 1.6 V

Low dropout voltage ensures efficient power conversion and less energy loss, providing stable output voltage even when input voltage is close to the output voltage.

Surface Mount: YES

Ease of installation and space-saving design for compact devices.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range allows the product to function in extreme conditions without compromising performance.

Technology: BICMOS

Combination of Bipolar and CMOS technologies offers high performance, low power consumption, and improved reliability.

No. of Terminals: 5

Simplifies the connection and interface with other components, reducing complexity in the design.

Adjustability: ADJUSTABLE

The adjustable feature allows users to fine-tune the output voltage as per their requirements, providing flexibility in different applications.

Maximum Output Current: 3 A

High output current capability makes it suitable for powering a wide range of loads in various devices.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO UCC383TDTR-ADJG3 attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage:

9 V

Minimum Input Voltage:

2.8 V

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Length:

10.16 mm

Maximum Line Regulation (%/V):

.031

Maximum Load Regulation (%):

.4 %

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

8.5 V

Minimum Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

5.13 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

Width:

8.925 mm

Trade Compliance

UCC383TDTR-ADJG3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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