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UCC3810TD2

Texas Instruments

UCC3810TD2 by Texas Instruments

UCC3810TD2 by Texas Instruments is a 24-terminal switching regulator with current-mode control, BUCK-BOOST configuration, and 1000 kHz max switching frequency. Ideal for applications requiring high efficiency power conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,771 parts In-Stock

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Digiode

USA . 225 parts In-Stock

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225

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Distributors (Availability)

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One Stop Electronics

USA . 1,360 parts In-Stock

1+ parts

$0.500

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1,360

$0.500

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Semicontronic

India . 1,553 parts In-Stock

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$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,553

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 648 parts In-Stock

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$6.500

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648

$6.500

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Parana Technologies

USA . 520 parts In-Stock

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$7.201

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$7.706

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520

$7.201

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$7.706

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DigiPath Technology Company

USA . 2,363 parts In-Stock

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$7.929

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2,363

$7.929

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IDEA Electronic Components Group

UK . 1,215 parts In-Stock

1+ parts

$8.091

100+ parts

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$7.282

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1,215

$8.091

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$7.282

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ChromeModa Solutions

Germany . 677 parts In-Stock

1+ parts

$8.091

100+ parts

$6.635

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677

$8.091

$6.635

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AZTECH Wire

Italy . 687 parts In-Stock

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$19.204

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$19.204

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Microchip USA

USA . 1,289 parts In-Stock

1+ parts

$118.580

100+ parts

$116.520

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$115.490

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$114.450

1,289

$118.580

$116.520

$115.490

$114.450

Corphita

USA . 1,720 parts In-Stock

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Corohmni

South Africa . 365 parts In-Stock

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Overview

Unlock the power of efficient energy management with the UCC3810TD2 by Texas Instruments. Built with cutting-edge BICMOS technology, this dual switching controller offers unmatched reliability and performance. Whether you're designing for automotive, industrial, or consumer electronics applications, this current-mode control device provides precise regulation and high switching frequency for optimal efficiency. Experience peace of mind knowing that Texas Instruments, a trusted leader in semiconductor manufacturing, stands behind every product they create. Elevate your design with the UCC3810TD2 and discover the difference quality and innovation can make in your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Space-saving design that can easily fit into compact electronic devices.

Control Mode: CURRENT-MODE

Provides stable and precise control over the output current, ensuring reliable performance.

Width (mm): 2.4409 mm

Compact width makes it suitable for applications where space is limited.

Maximum Switching Frequency: 1000 kHz

High switching frequency allows for efficient power conversion and minimizes energy loss.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Control Technique: PULSE WIDTH MODULATION

PWM control technique provides precise regulation of output voltage and current.

Switcher Config: BUCK-BOOST

Versatile configuration that can step up or step down the input voltage, making it suitable for various applications.

Maximum Supply Voltage (Vsup): 11 V

Can handle high supply voltage levels, making it compatible with a wide range of power sources.

Minimum Input Voltage: 8.3 V

Allows for operation with low input voltage levels, providing flexibility in powering the device.

Maximum Input Voltage: 11 V

Can handle high input voltage levels, ensuring compatibility with various power sources.

Technical Specifications

Switching Regulators & Controllers UCC3810TD2 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

11 V

Minimum Input Voltage:

8.3 V

JESD-30 Code:

R-XUUC-N24

Length:

2.4816 mm

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

11 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

1000 kHz

Technology:

BICMOS

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.4409 mm

Trade Compliance

UCC3810TD2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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