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UCC3810TD1

Texas Instruments

UCC3810TD1 by Texas Instruments

UCC3810TD1 by Texas Instruments is a dual switching controller with a max switching frequency of 1000 kHz. It operates in current-mode control technique and supports buck-boost switcher configuration. With a package size of 2.4409mm x 2.4816mm, it is ideal for applications requiring high-frequency power conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,385 parts In-Stock

1+ parts

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3,385

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Digiode

USA . 1,726 parts In-Stock

1+ parts

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1,726

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 942 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

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942

$2.500

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One Stop Electronics

USA . 249 parts In-Stock

1+ parts

$3.500

100+ parts

-

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249

$3.500

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Parana Technologies

USA . 2,159 parts In-Stock

1+ parts

$4.015

100+ parts

-

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$4.479

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2,159

$4.015

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$4.479

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DigiPath Technology Company

USA . 628 parts In-Stock

1+ parts

$4.421

100+ parts

$4.067

1k+ parts

-

10k+ parts

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628

$4.421

$4.067

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ChromeModa Solutions

Germany . 2,600 parts In-Stock

1+ parts

$4.511

100+ parts

$3.699

1k+ parts

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2,600

$4.511

$3.699

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IDEA Electronic Components Group

UK . 811 parts In-Stock

1+ parts

$4.511

100+ parts

-

1k+ parts

$4.060

10k+ parts

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811

$4.511

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$4.060

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AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$7.298

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784

$7.298

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Semicontronic

India . 206 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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206

$7.500

$7.312

$7.275

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Microchip USA

USA . 2,892 parts In-Stock

1+ parts

$122.260

100+ parts

$120.130

1k+ parts

$119.070

10k+ parts

$118.010

2,892

$122.260

$120.130

$119.070

$118.010

Corphita

USA . 3,179 parts In-Stock

1+ parts

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3,179

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Corohmni

South Africa . 446 parts In-Stock

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446

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Overview

Unlock the power of efficient energy management with the UCC3810TD1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality products like the UCC3810TD1 that deliver exceptional performance and reliability. Ideal for switching regulators and controllers, this dual switching controller offers customers unparalleled value with its compact design, current-mode control mode, and pulse width modulation technique. Say goodbye to inefficient energy consumption and hello to cost-effective solutions with the UCC3810TD1.

Feature Benefit Bullets

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Package Shape: RECTANGULAR

Sleek and modern design for improved aesthetics.

No. of Terminals: 24

Sufficient number of terminals for versatile connectivity options.

Control Mode: CURRENT-MODE

Provides accurate current control for optimal performance.

Width (mm): 2.4409 mm

Compact size for fitting into tight spaces.

Length: 2.4816 mm

Ideal dimensions for easy integration into various devices.

Maximum Switching Frequency: 1000 kHz

High switching frequency for efficient power conversion.

Technology: BICMOS

Combines benefits of bipolar and CMOS technologies for enhanced performance.

Control Technique: PULSE WIDTH MODULATION

Precise control of output voltage for stable operation.

Switcher Config: BUCK-BOOST

Versatile configuration for both step-up and step-down voltage conversion.

Maximum Supply Voltage (Vsup): 11 V

Supports a wide range of supply voltages for flexibility in usage.

Minimum Input Voltage: 8.3 V

Can operate efficiently even at low input voltages.

Maximum Input Voltage: 11 V

Can handle high input voltages without issues.

Technical Specifications

Switching Regulators & Controllers UCC3810TD1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

11 V

Minimum Input Voltage:

8.3 V

JESD-30 Code:

R-XUUC-N24

Length:

2.4816 mm

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

11 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

1000 kHz

Technology:

BICMOS

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.4409 mm

Trade Compliance

UCC3810TD1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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