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UCC38051DR

Texas Instruments

UCC38051DR by Texas Instruments

UCC38051DR by Texas Instruments is a current-mode power factor controller with boost switcher configuration. It operates b/w 0 to 70°C, suitable for commercial applications. With a max output current of 0.75A and BICMOS technology, it offers efficient pulse width modulation control for input voltages ranging from 10V to 18V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,463 parts In-Stock

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Digiode

USA . 1,218 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 543 parts In-Stock

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$2.500

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543

$2.500

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Semicontronic

India . 957 parts In-Stock

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$3.500

100+ parts

$3.412

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$3.395

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957

$3.500

$3.412

$3.395

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AZTECH Wire

Italy . 874 parts In-Stock

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$6.476

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One Stop Electronics

USA . 229 parts In-Stock

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$6.500

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229

$6.500

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Parana Technologies

USA . 2,030 parts In-Stock

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$12.663

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$13.126

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2,030

$12.663

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$13.126

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DigiPath Technology Company

USA . 2,051 parts In-Stock

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$13.943

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$12.828

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2,051

$13.943

$12.828

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ChromeModa Solutions

Germany . 5,426 parts In-Stock

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$14.228

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$11.667

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$14.228

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IDEA Electronic Components Group

UK . 619 parts In-Stock

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$14.228

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$13.517

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$12.805

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619

$14.228

$13.517

$12.805

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A-Z Elektronik GmbH

Germany . 7,426 parts In-Stock

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Corphita

USA . 1,915 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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Microchip USA

USA . 246 parts In-Stock

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Overview

Enhance your power management system with the UCC38051DR from Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability. This switching regulator and controller offers unmatched performance for various applications. With advanced features like current-mode control and pulse width modulation, this product guarantees efficient power conversion. Trust Texas Instruments to deliver innovative solutions that provide value and benefits to your projects. Upgrade your power systems today with the UCC38051DR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the regulator, ensuring reliability in various environments.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and making it ideal for compact designs.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this regulator can function effectively even in hot conditions, offering robust performance.

Control Mode: CURRENT-MODE

The current-mode control mode offers precise current regulation, optimizing efficiency and stability in the switching regulator operation.

Nominal Input Voltage: 12 V

The 12V nominal input voltage is suitable for a wide range of applications, providing flexibility and compatibility with various power sources.

Maximum Output Current: 0.75 A

With a maximum output current of 0.75A, this regulator can efficiently handle moderate to low power requirements, making it suitable for many electronic devices.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique allows for precise control over the output voltage, ensuring stable and accurate power delivery to connected devices.

Technical Specifications

Switching Regulators & Controllers UCC38051DR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

UCC38051DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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