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UCC35702NG4

Texas Instruments

UCC35702NG4 by Texas Instruments

UCC35702NG4 by Texas Instruments is a switching controller with 14 terminals, operating temperature range of 0-70°C, and max output current of 1.2A. It utilizes voltage-mode control technique for applications requiring pulse width modulation in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,747 parts In-Stock

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Digiode

USA . 2,644 parts In-Stock

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Ampacity Inc.

Singapore . 1,345 parts In-Stock

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$0.500

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$0.500

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Semicontronic

India . 391 parts In-Stock

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$4.500

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$4.388

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$4.365

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391

$4.500

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$4.365

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Parana Technologies

USA . 866 parts In-Stock

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$5.536

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$6.300

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866

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DigiPath Technology Company

USA . 509 parts In-Stock

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$6.096

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$5.608

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509

$6.096

$5.608

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IDEA Electronic Components Group

UK . 1,034 parts In-Stock

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$6.220

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$5.598

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1,034

$6.220

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ChromeModa Solutions

Germany . 619 parts In-Stock

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$6.220

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$5.100

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619

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AZTECH Wire

Italy . 782 parts In-Stock

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$7.422

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One Stop Electronics

USA . 678 parts In-Stock

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$7.500

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Corphita

USA . 3,619 parts In-Stock

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Microchip USA

USA . 1,252 parts In-Stock

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Corohmni

South Africa . 354 parts In-Stock

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Overview

Enhance your power management solutions with the UCC35702NG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable and efficient Switching Regulators & Controllers like no other. This versatile device offers a wide range of applications, providing value and benefits to customers in various industries. Say goodbye to power issues and hello to seamless performance with the UCC35702NG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting various components and peripherals to the regulator/controller.

Control Mode: VOLTAGE-MODE

Voltage-mode control allows for precise regulation of output based on input voltage, ensuring stability and reliability in operation.

Maximum Output Current: 1.2 A

The high maximum output current capability allows the regulator/controller to power a wide range of devices efficiently.

Technology: BICMOS

BICMOS technology offers a combination of high performance and low power consumption, making the regulator/controller energy efficient.

Switcher Config: SINGLE

The single switcher configuration simplifies the design and operation of the regulator/controller, reducing complexity and improving reliability.

Technical Specifications

Switching Regulators & Controllers UCC35702NG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

13.5 V

Minimum Input Voltage:

9.6 V

Nominal Input Voltage:

11 V

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

700 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UCC35702NG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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