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UCC29910AEVM-730

Texas Instruments

UCC29910AEVM-730 by Texas Instruments

UCC29910AEVM-730 by Texas Instruments is a Power Management Evaluation Board for UCC29910A IC. It features Power Factor Correction, comes in a Box package, and includes board(s). Ideal for testing PFC functionality in power supply designs.

Median Price

$123.080

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1 parts In-Stock

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$88.560

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1

$88.560

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Element14

Singapore . 1 parts In-Stock

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$157.600

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1

$157.600

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Vyrian

USA . 6,193 parts In-Stock

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Digiode

USA . 3,455 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 231 parts In-Stock

1+ parts

$12.562

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231

$12.562

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Ampacity Inc.

Singapore . 570 parts In-Stock

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$105.100

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570

$105.100

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One Stop Electronics

USA . 492 parts In-Stock

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$122.100

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492

$122.100

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Semicontronic

India . 1,415 parts In-Stock

1+ parts

$192.100

100+ parts

$187.298

1k+ parts

$186.337

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1,415

$192.100

$187.298

$186.337

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ChromeModa Solutions

Germany . 2,834 parts In-Stock

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IDEA Electronic Components Group

UK . 2,119 parts In-Stock

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DigiPath Technology Company

USA . 1,808 parts In-Stock

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Parana Technologies

USA . 1,746 parts In-Stock

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$0.422

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Corphita

USA . 1,522 parts In-Stock

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1,522

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Corohmni

South Africa . 196 parts In-Stock

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Overview

Unlock the full potential of your power management systems with the UCC29910AEVM-730 by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers exceptional products that exceed industry standards. This development board is perfect for evaluating and demonstrating power factor correction, offering unparalleled efficiency and performance. Take your designs to the next level with the UCC29910AEVM-730 and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Other Names: 296-46016 UCC29910AEVM-730-ND

Identifiable and easily searchable names for the product

Category: Development Boards, Kits, Programmers Evaluation Boards

This product falls under a category that is dedicated to aiding in the development and evaluation process, making it suitable for testing and prototyping purposes

Package: Box

Comes in a package that provides protection and organization for the product

Type: Power Management

Designed for managing power efficiently, ensuring optimal performance and energy savings

Function: Power Factor Correction

Helps in improving power efficiency by correcting the power factor, making it a suitable choice for enhancing energy utilization

Utilized IC / Part: UCC29910A

Incorporates a specific integrated circuit/part that is known for its performance and reliability in power management applications

Supplied Contents: Board(s)

Includes necessary boards for operation, providing a complete solution out of the box

Base Product Number: UCC299

Part of a product line with a recognized base number, indicating compatibility and standardization within the series

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Designed to withstand various environmental conditions, ensuring durability and reliability in different settings

Technical Specifications

Additional Parts UCC29910AEVM-730 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-46016
UCC29910AEVM-730-ND

Function:

Power Factor Correction

Type:

Power Management

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

UCC29910A

Package:

Box

Embedded:

No

Standard Package:

1

Base Product Number:

UCC299

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

UCC29910AEVM-730 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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