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UCC284DPTR-12

Texas Instruments

UCC284DPTR-12 by Texas Instruments

UCC284DPTR-12 by Texas Instruments is a fixed negative single output LDO regulator with an output voltage of 12V and max current of 0.5A. It operates in temperatures ranging from -55°C to 150°C, making it suitable for various applications requiring stable voltage regulation in compact spaces. The package style is small outline with gull wing terminals, ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,524 parts In-Stock

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4,524

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Digiode

USA . 3,003 parts In-Stock

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3,003

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Distributors (Availability)

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Semicontronic

India . 1,239 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,239

$5.500

$5.362

$5.335

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Parana Technologies

USA . 1,950 parts In-Stock

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$6.493

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$7.239

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$6.493

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$7.239

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DigiPath Technology Company

USA . 1,958 parts In-Stock

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$7.149

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$7.149

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ChromeModa Solutions

Germany . 2,975 parts In-Stock

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$7.295

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$5.982

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2,975

$7.295

$5.982

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IDEA Electronic Components Group

UK . 870 parts In-Stock

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$7.295

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$6.566

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870

$7.295

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$6.566

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One Stop Electronics

USA . 1,024 parts In-Stock

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$8.500

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$8.500

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AZTECH Wire

Italy . 292 parts In-Stock

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$16.195

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Ampacity Inc.

Singapore . 192 parts In-Stock

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$17.500

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$17.500

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Corphita

USA . 4,616 parts In-Stock

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Corohmni

South Africa . 186 parts In-Stock

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Overview

Discover the exceptional quality and reliability of Texas Instruments with the UCC284DPTR-12 fixed negative single output LDO regulator. This innovative product offers a nominal output voltage of 12V and a maximum output current of 0.5A, making it ideal for a wide range of applications. Whether you're looking to power up your electronic devices or regulate voltage in your circuits, this regulator delivers consistent performance and efficiency. Trust Texas Instruments to provide you with superior technology and cutting-edge solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Operating Temperature (TJ-Max): 150 °C

Can operate efficiently in high temperature environments, making it suitable for a wide range of applications.

Technology: BCDMOS

Utilizes advanced BCDMOS technology for reliable and stable voltage regulation.

Operating Temperature (TJ-Min): -55 °C

Capable of functioning even in extremely low temperatures, offering versatility in various operating conditions.

Nominal Output Voltage-1: 12 V

Provides a stable output voltage of 12V, ideal for powering sensitive electronic components.

Maximum Output Current-1: 0.5 A

Can deliver a maximum output current of 0.5A, suitable for a wide range of low-power applications.

Technical Specifications

Fixed Regulators - Negative Single Output LDO UCC284DPTR-12 attributes and parameters. Explore more Fixed Regulators - Negative Single Output LDO devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

.5 A

Nominal Output Voltage-1:

12 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

UCC284DPTR-12 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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