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UCC283TDTR-ADJG3

Texas Instruments

UCC283TDTR-ADJG3 by Texas Instruments

UCC283TDTR-ADJG3 by Texas Instruments is an adjustable positive single output LDO regulator with a max output current of 3A and a max dropout voltage of 0.6V. It operates in temperatures ranging from -55°C to 150°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,107 parts In-Stock

1+ parts

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6,107

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Digiode

USA . 3,075 parts In-Stock

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3,075

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Euro-Tech

UK . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 864 parts In-Stock

1+ parts

$4.794

100+ parts

-

1k+ parts

$5.302

10k+ parts

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864

$4.794

-

$5.302

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DigiPath Technology Company

USA . 1,794 parts In-Stock

1+ parts

$5.279

100+ parts

$4.857

1k+ parts

-

10k+ parts

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1,794

$5.279

$4.857

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ChromeModa Solutions

Germany . 506 parts In-Stock

1+ parts

$5.387

100+ parts

$4.417

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506

$5.387

$4.417

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IDEA Electronic Components Group

UK . 235 parts In-Stock

1+ parts

$5.387

100+ parts

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$4.848

10k+ parts

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235

$5.387

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$4.848

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AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$9.613

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393

$9.613

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One Stop Electronics

USA . 594 parts In-Stock

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$11.500

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594

$11.500

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Corphita

USA . 4,658 parts In-Stock

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4,658

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Overview

Unlock top-notch performance and reliability with the UCC283TDTR-ADJG3 from Texas Instruments. As a leader in the industry, Texas Instruments delivers unmatched quality and innovation in adjustable regulators. This versatile product is perfect for a wide range of applications, offering customers seamless adjustability, precise voltage regulation, and superior efficiency. Trust in Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level. Elevate your designs with the UCC283TDTR-ADJG3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Dropout Voltage-1: 1.6 V

The low maximum dropout voltage ensures efficient power delivery even when input voltage is close to output voltage.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit designs.

Operating Temperature (TJ-Max): 150 °C

High operating temperature range allows for versatile usage in different environments.

Technology: BICMOS

The BICMOS technology used ensures high performance and efficiency.

Package Shape: RECTANGULAR

Rectangular package shape provides ease of handling and mounting in circuits.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable connection to the circuit.

Operating Temperature (TJ-Min): -55 °C

Low minimum operating temperature allows for reliable performance even in extreme cold conditions.

Packing Method: TR

TR packing method ensures safe and secure transportation of the product.

Minimum Output Voltage-1: 1.25 V

The minimum output voltage of 1.25 V allows for fine adjustment and precise power delivery.

No. of Terminals: 5

Having 5 terminals provides flexibility in connections and configurations.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO UCC283TDTR-ADJG3 attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.4 V

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Length:

10.16 mm

Maximum Line Regulation (%/V):

.031

Maximum Load Regulation (%):

.4 %

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

7 V

Minimum Output Voltage-1:

1.25 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

5.13 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.925 mm

Trade Compliance

UCC283TDTR-ADJG3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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