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UCC28250EVM-564

Texas Instruments

UCC28250EVM-564 by Texas Instruments

UCC28250EVM-564 by Texas Instruments is a DC/DC evaluation board with 100W output power, 3.3V voltage output, and 30A current output. It operates with an input voltage range of 36V to 75V, uses Buck topology at a switching frequency of 200kHz, and is designed for DC/DC step-down applications.

Median Price

$118.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 32 parts In-Stock

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$99.000

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DigiKey

USA . 1 parts In-Stock

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$118.800

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Mouser Electronics

USA . 4 parts In-Stock

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$118.810

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Digiode

USA . 1,553 parts In-Stock

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$94.050

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Vyrian

USA . 7,223 parts In-Stock

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Semicontronic

India . 13 parts In-Stock

1+ parts

$84.150

100+ parts

$82.046

1k+ parts

$81.626

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13

$84.150

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$81.626

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Corphita

USA . 3,555 parts In-Stock

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$89.100

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$89.100

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Corohmni

South Africa . 363 parts In-Stock

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$99.000

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Parana Technologies

USA . 2,340 parts In-Stock

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$1.139

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IDEA Electronic Components Group

UK . 1,746 parts In-Stock

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DigiPath Technology Company

USA . 1,025 parts In-Stock

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ChromeModa Solutions

Germany . 516 parts In-Stock

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Perfect Parts

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Overview

Unlock the full potential of your power supply designs with the UCC28250EVM-564 by Texas Instruments. This top-of-the-line evaluation board offers unparalleled quality and reliability, backed by the trusted reputation of Texas Instruments. Ideal for DC/DC and Step Down applications, this board provides a robust solution for delivering 100W of power output at 3.3V and 30A. Whether you're a seasoned professional or new to power supply design, the UCC28250EVM-564 is sure to streamline your development process and deliver exceptional results. Experience the efficiency and performance benefits this exceptional product has to offer.

Feature Benefit Bullets

Other Names: UCC28250EVM564, 296-31342

Easy to identify and locate the product for purchase or reference.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Suitable for those looking to evaluate or prototype DC/DC & AC/DC SMPS circuits.

Main Purpose: DC/DC, Step Down

Specifically designed for DC/DC step-down applications, ensuring efficient power conversion.

Power - Output: 100 W

Capable of delivering a high power output, suitable for demanding applications.

Voltage - Output: 3.3V

Provides a stable output voltage of 3.3V, common in many electronic devices.

Current - Output: 30A

Delivers a high output current of 30A, suitable for powering multiple devices or components.

Voltage - Input: 36V ~ 75V

Wide input voltage range allows compatibility with different power sources.

Regulator Topology: Buck

Efficient buck regulator topology for step-down voltage conversion.

Frequency - Switching: 200kHz

High switching frequency for improved efficiency and smaller components.

Board Type: Fully Populated

Ready-to-use evaluation board with all necessary components already soldered.

Utilized IC / Part: UCC28250

Utilizes the UCC28250 integrated circuit for reliable and efficient power regulation.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Minimal moisture sensitivity ensures long-term reliability in various environments.

Technical Specifications

Additional Parts UCC28250EVM-564 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Other Names:

UCC28250EVM564
296-31342
UCC28250EVM-564-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

30A

Power - Output:

100 W

Standard Package:

1

Regulator Topology:

Buck

Frequency - Switching:

200kHz

Supplied Contents:

Board(s)

Voltage - Output:

3.3V

Board Type:

Fully Populated

Outputs and Type:

1, Isolated

Utilized IC / Part:

UCC28250

Package:

Box

Voltage - Input:

36V ~ 75V

Base Product Number:

UCC28250

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

UCC28250EVM-564 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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