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UCC28221DR

Texas Instruments

UCC28221DR by Texas Instruments

UCC28221DR by Texas Instruments is a switching regulator/controller with a max operating temperature of 105°C. It has a control mode of current-mode and a max switching frequency of 1100 kHz. This IC is commonly used in industrial applications for pulse width modulation control in push-pull switcher configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,468 parts In-Stock

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Digiode

USA . 4,032 parts In-Stock

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Nova Conductors

Japan . 85 parts In-Stock

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Ampacity Inc.

Singapore . 1,470 parts In-Stock

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$2.500

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$2.500

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One Stop Electronics

USA . 154 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 794 parts In-Stock

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$5.608

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Parana Technologies

USA . 495 parts In-Stock

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$7.286

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$7.784

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DigiPath Technology Company

USA . 1,991 parts In-Stock

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$8.022

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$7.380

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$8.022

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ChromeModa Solutions

Germany . 3,925 parts In-Stock

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$8.186

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$6.713

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IDEA Electronic Components Group

UK . 886 parts In-Stock

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$8.186

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$7.367

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Microchip USA

USA . 5,152 parts In-Stock

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Continental Prestige Electronics

USA . 4,269 parts In-Stock

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Argo Parts USA

USA . 1,837 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 81 parts In-Stock

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Overview

Experience the next level of power management with the UCC28221DR by Texas Instruments. As a leader in the industry, Texas Instruments ensures the highest quality and reliability in their products. The UCC28221DR is a cutting-edge switching regulator and controller that offers unparalleled efficiency and performance. With its small outline package and surface mount capability, it's perfect for a wide range of applications. Whether you're designing for industrial or consumer electronics, this dual switching controller delivers precise control and optimal power conversion. Say goodbye to wasted energy and hello to increased efficiency with the UCC28221DR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material ensures easy handling and product longevity.

Surface Mount: YES

Easy to integrate into circuit boards for efficient assembly and space-saving.

No. of Terminals: 16

Provides flexibility in connecting to various components and peripherals.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial applications.

Control Mode: CURRENT-MODE

Offers precise control over current output, ensuring stability and efficiency.

Nominal Input Voltage: 12 V

Compatible with common voltage requirements, making it versatile for different setups.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies for optimal performance.

Maximum Switching Frequency: 1100 kHz

High switching frequency enables fast response and regulation of output voltage.

Minimum Input Voltage: 8 V

Allows for operation even at low input voltages, increasing the product's usability.

Technical Specifications

Switching Regulators & Controllers UCC28221DR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14.5 V

Minimum Input Voltage:

8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.01 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1100 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

UCC28221DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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