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UCC28061DRG4

Texas Instruments

UCC28061DRG4 by Texas Instruments

UCC28061DRG4 by Texas Instruments is a current-mode power factor controller with a control technique of pulse width modulation. It operates in an automotive temperature grade range from -40 to 125°C and has a nominal input voltage of 16V. This switching regulator is designed for applications requiring a compact small outline package with surface mount capability.

Median Price

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4

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1k+

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Chip Stock

USA . 10,802 parts In-Stock

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USA . 2,773 parts In-Stock

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Nova Conductors

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Semicontronic

India . 1,069 parts In-Stock

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$1.500

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$1.462

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$1.455

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Corohmni

South Africa . 232 parts In-Stock

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Ampacity Inc.

Singapore . 842 parts In-Stock

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One Stop Electronics

USA . 494 parts In-Stock

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Parana Technologies

USA . 58 parts In-Stock

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AZTECH Wire

Italy . 477 parts In-Stock

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ChromeModa Solutions

Germany . 1,147 parts In-Stock

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IDEA Electronic Components Group

UK . 459 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

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Argo Parts USA

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DigiPath Technology Company

USA . 1,315 parts In-Stock

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Corphita

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iodParts Technologies Inc.

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Overview

Experience unparalleled efficiency and reliability with the UCC28061DRG4 from Texas Instruments, a leading manufacturer in the industry of Switching Regulators & Controllers. This innovative product offers advanced control mode technology, ensuring optimal performance in automotive applications. With a wide range of operating temperatures and a compact design, this power factor controller provides superior functionality while delivering exceptional value to customers seeking high-quality solutions for their power supply needs. Trust Texas Instruments to deliver cutting-edge products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and insulation for the internal components of the switching regulator, ensuring durability and safety.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and labor costs in production.

Nominal Supply Voltage (Vsup): 16 V

Having a nominal supply voltage of 16 V makes this regulator suitable for applications requiring stable power at this voltage level.

Control Mode: CURRENT-MODE

Current-mode control provides fast transient response, excellent line regulation, and accurate current limiting for optimal performance.

Width (mm): 3.9 mm

The compact width of 3.9 mm allows for high-density mounting on the PCB, saving valuable space in electronic devices.

Temperature Grade: AUTOMOTIVE

With an automotive temperature grade, this switching regulator can withstand harsh environments and temperature fluctuations commonly found in automotive applications.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides efficient and precise control of the output voltage, resulting in optimal power conversion efficiency.

Technical Specifications

Switching Regulators & Controllers UCC28061DRG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

21 V

Minimum Input Voltage:

14 V

Nominal Input Voltage:

16 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

16

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Current (Isup):

8 mA

Nominal Supply Voltage (Vsup):

16 V

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

UCC28061DRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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