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UCC28019EVM

Texas Instruments

UCC28019EVM by Texas Instruments

UCC28019EVM by Texas Instruments is a Power Management Evaluation Board for the UCC28019 IC. It offers 350W, 390V, 900mA output with an input range of 85~265VAC. Ideal for Power Factor Correction applications, it operates in Continuous Current Mode and comes in a box package.

Median Price

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Lifecycle Status

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2

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Vyrian

USA . 7,728 parts In-Stock

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AZTECH Wire

Italy . 266 parts In-Stock

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Ampacity Inc.

Singapore . 536 parts In-Stock

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Component Stockers USA

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Semicontronic

India . 956 parts In-Stock

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One Stop Electronics

USA . 1,527 parts In-Stock

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Corphita

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IDEA Electronic Components Group

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ChromeModa Solutions

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DigiPath Technology Company

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Parana Technologies

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Corohmni

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Overview

Discover the UCC28019EVM by Texas Instruments, a top-tier power management solution designed to meet your needs. With a focus on quality and reliability, Texas Instruments brings you a versatile evaluation board that offers seamless power factor correction for a range of applications. Whether you are looking to optimize efficiency or enhance performance, this product delivers exceptional value and benefits. Take advantage of its advanced features and unlock new possibilities in your projects. Elevate your power management capabilities with the UCC28019EVM today.

Feature Benefit Bullets

Other Names: 296-23116

Easy to identify and order from suppliers.

Category: Development Boards, Kits, Programmers

Versatile for developing and testing power management solutions.

Package: Box

Provides protection and easy storage for the product.

Type: Power Management

Specifically designed for efficient power management applications.

Function: Power Factor Correction

Improves energy efficiency and reduces power losses.

Utilized IC / Part: UCC28019

Utilizes advanced IC for reliable and efficient performance.

Primary Attributes: 350W, 390V, 900mA Output, 85~265VAC Input

Capable of handling a wide range of power requirements and input voltages.

Supplied Contents: Board(s)

Includes necessary components for immediate testing and prototyping.

Secondary Attributes: Continuous Current Mode

Enables stable operation and precise control of the output current.

Base Product Number: UCC280

Part of a reliable series of power management products from the manufacturer.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for a wide range of environmental conditions.

Technical Specifications

Additional Parts UCC28019EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-23116

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Function:

Power Factor Correction

Type:

Power Management

Supplied Contents:

Board(s)

Secondary Attributes:

Continuous Current Mode

Utilized IC / Part:

UCC28019

Package:

Box

Embedded:

No

Primary Attributes:

350W, 390V, 900mA Output, 85~265VAC Input

Base Product Number:

UCC280

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

UCC28019EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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