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UC3909N

Texas Instruments

UC3909N by Texas Instruments

UC3909N by Texas Instruments is a switching regulator with 15V nominal voltage, 242 kHz max switching frequency, and 19mA max supply current. Ideal for battery charge control applications due to its current-mode control technique and single switcher configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,545 parts In-Stock

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Digiode

USA . 4,938 parts In-Stock

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LWI Electronics Inc

India . 17 parts In-Stock

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Sogenti Electronics

Canada . 10 parts In-Stock

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One Stop Electronics

USA . 1,523 parts In-Stock

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$3.500

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$3.500

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Andel Nordic

Denmark . 332 parts In-Stock

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$10.392

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$9.976

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$9.976

332

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$9.976

AZTECH Wire

Italy . 347 parts In-Stock

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$10.528

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Parana Technologies

USA . 1,216 parts In-Stock

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$12.994

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$13.485

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DigiPath Technology Company

USA . 1,281 parts In-Stock

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$14.308

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ChromeModa Solutions

Germany . 4,541 parts In-Stock

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$14.600

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$11.972

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IDEA Electronic Components Group

UK . 2,107 parts In-Stock

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$14.600

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$13.870

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$13.140

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QUARKTWIN TECHNOLOGY LTD

USA . 18,723 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,113 parts In-Stock

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Corphita

USA . 3,478 parts In-Stock

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Microchip USA

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Overview

Enhance your power supply designs with the UC3909N from Texas Instruments, a top-quality switching regulator that delivers reliable performance and efficiency. Designed with precision and innovation, this battery charge controller offers customers unparalleled value and benefits for their applications. Whether you are looking to optimize power management in industrial, automotive, or consumer electronics, the UC3909N is the perfect solution to meet your needs. Trust Texas Instruments for cutting-edge technology and superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Nominal Supply Voltage (Vsup): 15 V

Provides a stable supply voltage to ensure efficient operation of the switching regulator.

Maximum Operating Temperature: 70 °C

Allows the product to operate in a wide range of temperatures, making it suitable for various environments.

Control Mode: CURRENT-MODE

This mode provides accurate control over the output current, ensuring efficient power regulation.

Maximum Output Current: 0.1 A

Capable of delivering a relatively high output current, making it suitable for powering various electronic devices.

Technical Specifications

Switching Regulators & Controllers UC3909N attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

35 V

Minimum Input Voltage:

8.8 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDIP-T20

Length:

19.3 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

19 mA

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

242 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

UC3909N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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