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UC3856QG3

Texas Instruments

UC3856QG3 by Texas Instruments

UC3856QG3 by Texas Instruments is a 20-terminal switching controller with a max output current of 2A and a max switching frequency of 230kHz. It operates in commercial temperature grade, using pulse width modulation control technique for push-pull switcher configuration. Ideal for applications requiring precise current-mode control in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,971 parts In-Stock

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2,971

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Digiode

USA . 2,468 parts In-Stock

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2,468

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Distributors (Availability)

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Semicontronic

India . 1,112 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,112

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 454 parts In-Stock

1+ parts

$1.500

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454

$1.500

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Ampacity Inc.

Singapore . 530 parts In-Stock

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$3.500

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530

$3.500

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Parana Technologies

USA . 209 parts In-Stock

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$5.615

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$6.413

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209

$5.615

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$6.413

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ChromeModa Solutions

Germany . 4,341 parts In-Stock

1+ parts

$6.309

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$5.173

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4,341

$6.309

$5.173

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IDEA Electronic Components Group

UK . 1,949 parts In-Stock

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$6.309

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$5.678

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1,949

$6.309

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$5.678

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AZTECH Wire

Italy . 503 parts In-Stock

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$10.520

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503

$10.520

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QUARKTWIN TECHNOLOGY LTD

USA . 16,602 parts In-Stock

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Corphita

USA . 4,895 parts In-Stock

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Microchip USA

USA . 4,571 parts In-Stock

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DigiPath Technology Company

USA . 1,335 parts In-Stock

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$5.688

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Perfect Parts

USA . 633 parts In-Stock

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Corohmni

South Africa . 400 parts In-Stock

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400

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Overview

Discover the cutting-edge UC3856QG3 from Texas Instruments, a leading manufacturer in the realm of Switching Regulators & Controllers. This innovative product offers unparalleled performance and reliability, making it ideal for a wide range of applications. With its advanced technology and high-quality design, the UC3856QG3 ensures maximum efficiency and precision in power management. Experience seamless control and superior output with this top-of-the-line switching controller. Elevate your projects to new heights with the UC3856QG3 - the ultimate solution for all your power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the switching regulator, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly.

Maximum Operating Temperature: 70 °C

Ensures the switching regulator can operate efficiently within a wide range of temperature conditions, making it suitable for various applications.

Control Mode: CURRENT-MODE

Current-mode control provides accurate and stable regulation of the output voltage, improving overall performance and efficiency.

Maximum Switching Frequency: 230 kHz

High switching frequency allows for fast response time and reduced output ripple, resulting in a stable and reliable power supply.

Technical Specifications

Switching Regulators & Controllers UC3856QG3 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

8 V

Nominal Input Voltage:

15 V

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

230 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8.965 mm

Trade Compliance

UC3856QG3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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