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UC3823QG3

Texas Instruments

UC3823QG3 by Texas Instruments

UC3823QG3 by Texas Instruments is a voltage-mode switching controller with a max output current of 2A and a max switching frequency of 1000 kHz. It operates in the commercial temperature grade range from 0 to 70°C, making it suitable for various applications requiring efficient power regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,992 parts In-Stock

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6,992

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Digiode

USA . 1,569 parts In-Stock

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1,569

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Corel Iberica Componentes, S.L.

Spain . 2 parts In-Stock

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2

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Distributors (Availability)

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Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

$6.763

100+ parts

-

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$7.427

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2,168

$6.763

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$7.427

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One Stop Electronics

USA . 661 parts In-Stock

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$7.500

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661

$7.500

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ChromeModa Solutions

Germany . 4,596 parts In-Stock

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$7.599

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$6.231

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4,596

$7.599

$6.231

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IDEA Electronic Components Group

UK . 1,184 parts In-Stock

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$7.599

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$6.839

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1,184

$7.599

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$6.839

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AZTECH Wire

Italy . 696 parts In-Stock

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$12.337

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696

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Corphita

USA . 3,783 parts In-Stock

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DigiPath Technology Company

USA . 1,550 parts In-Stock

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$6.851

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$6.851

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Perfect Parts

USA . 633 parts In-Stock

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Microchip USA

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Overview

Elevate your power supply designs with the UC3823QG3 from Texas Instruments. As a leading manufacturer in the industry, TI delivers top-notch quality and reliability that you can trust. This switching regulator/controller is perfect for various applications, offering maximum efficiency and performance. With its voltage-mode control and pulse width modulation technique, you can expect precise output voltage regulation and optimal power management. Say goodbye to subpar products and hello to superior results with the UC3823QG3. Choose Texas Instruments for cutting-edge technology and unparalleled value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the product, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Control Mode: VOLTAGE-MODE

Provides precise control over the output voltage, ensuring stability and reliability in power regulation.

Nominal Input Voltage: 15 V

Suitable for a wide range of input voltages, making it versatile for different applications.

Maximum Output Current: 2 A

Capable of delivering sufficient current to power various devices or components, making it a powerful regulator.

Maximum Switching Frequency: 1000 kHz

High switching frequency allows for efficient power conversion, reducing energy losses and ensuring fast response times.

Technical Specifications

Switching Regulators & Controllers UC3823QG3 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO BE CONFIGURED IN CURRENT MODE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

15 V

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

2 A

Nominal Output Voltage:

5.1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

1000 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8.965 mm

Trade Compliance

UC3823QG3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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