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UC3717AQTR

Texas Instruments

UC3717AQTR by Texas Instruments

UC3717AQTR by Texas Instruments is a Motion Control IC in PLASTIC/EPOXY package with 20 terminals. It operates at 5V, supports power supplies of 5-40V, and has a max output current of 1.2A. Ideal for STEPPER MOTOR CONTROL applications due to its BIPOLAR technology and compact CHIP CARRIER style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,992 parts In-Stock

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2,992

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Digiode

USA . 2,764 parts In-Stock

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2,764

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Distributors (Availability)

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One Stop Electronics

USA . 943 parts In-Stock

1+ parts

$0.500

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943

$0.500

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Ampacity Inc.

Singapore . 718 parts In-Stock

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$2.500

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718

$2.500

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Parana Technologies

USA . 1,137 parts In-Stock

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$3.570

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$4.092

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1,137

$3.570

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$4.092

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DigiPath Technology Company

USA . 1,904 parts In-Stock

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$3.931

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1,904

$3.931

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IDEA Electronic Components Group

UK . 1,573 parts In-Stock

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$4.011

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$3.610

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1,573

$4.011

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$3.610

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ChromeModa Solutions

Germany . 410 parts In-Stock

1+ parts

$4.011

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$3.289

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410

$4.011

$3.289

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Semicontronic

India . 1,414 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

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$6.305

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1,414

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 263 parts In-Stock

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$7.758

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263

$7.758

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Component Stockers USA

USA . 767 parts In-Stock

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$99.990

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767

$99.990

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Corphita

USA . 3,027 parts In-Stock

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Perfect Parts

USA . 672 parts In-Stock

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672

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Microchip USA

USA . 299 parts In-Stock

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Corohmni

South Africa . 74 parts In-Stock

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Overview

Elevate your motion control applications to the next level with the Texas Instruments UC3717AQTR. Crafted by a renowned manufacturer, this high-quality motion control IC offers unparalleled performance and reliability. Ideal for stepper motor controllers, this chip carrier package delivers a wide range of power supplies and a maximum output current of 1.2A. Experience seamless operation, precise control, and enhanced functionality with the UC3717AQTR, setting a new standard for motion control ICs in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the IC, ensuring reliability and longevity.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort in manufacturing.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage requirement for many applications, ensuring compatibility with a wide range of systems.

Power Supplies (V): 5,10/40

Offers flexibility in power input options, allowing for compatibility with different power sources.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for use in various environments.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions, increasing its versatility in different settings.

Maximum Seated Height: 4.57 mm

Low profile design helps in conserving space and enables compact device designs.

Maximum Output Current: 1.2 A

Capable of delivering high output current, suitable for driving stepper motors with varying power requirements.

Technical Specifications

Motion Control ICs UC3717AQTR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 10V TO 46V SUPPLY

Other IC type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,10/40

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8.965 mm

Trade Compliance

UC3717AQTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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