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UC2827N-1G4

Texas Instruments

UC2827N-1G4 by Texas Instruments

UC2827N-1G4 by Texas Instruments is a 24-terminal switching controller with voltage-mode control, operating b/w -40 to 85°C. It offers a max output current of 1A at a frequency of up to 500 kHz. Ideal for industrial applications requiring pulse width modulation in push-pull configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,426 parts In-Stock

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Digiode

USA . 3,863 parts In-Stock

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3,863

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Distributors (Availability)

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One Stop Electronics

USA . 1,337 parts In-Stock

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$0.500

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-

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1,337

$0.500

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Semicontronic

India . 467 parts In-Stock

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$2.500

100+ parts

$2.438

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$2.425

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467

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 1,286 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 847 parts In-Stock

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$7.279

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847

$7.279

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Parana Technologies

USA . 163 parts In-Stock

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$10.237

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$10.769

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163

$10.237

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$10.769

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DigiPath Technology Company

USA . 908 parts In-Stock

1+ parts

$11.272

100+ parts

$10.370

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908

$11.272

$10.370

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ChromeModa Solutions

Germany . 3,494 parts In-Stock

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$11.502

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$9.432

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3,494

$11.502

$9.432

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IDEA Electronic Components Group

UK . 896 parts In-Stock

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$11.502

100+ parts

$10.927

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$10.352

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896

$11.502

$10.927

$10.352

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Corphita

USA . 1,138 parts In-Stock

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Corohmni

South Africa . 357 parts In-Stock

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Microchip USA

USA . 224 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the Texas Instruments UC2827N-1G4 Switching Regulator & Controller. Designed with precision and expertise, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this innovative technology provides efficient power management and control. Experience the benefits of superior performance and functionality that only Texas Instruments can deliver. Upgrade your devices today with the UC2827N-1G4 and discover the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside the package.

Maximum Operating Temperature: 85 °C

Allows the product to operate efficiently even in high temperature environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of the output voltage, ensuring stability.

Nominal Input Voltage: 15 V

Suitable for a wide range of applications that require a 15 V input voltage.

Maximum Output Current: 1 A

Capable of delivering up to 1 A output current, making it suitable for moderately powered devices.

Technical Specifications

Switching Regulators & Controllers UC2827N-1G4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO WORK IN CURRENT MODE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

20 V

Minimum Input Voltage:

9.5 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e4

Length:

31.75 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

500 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

15.24 mm

Trade Compliance

UC2827N-1G4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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