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UA79M12MJGB

Texas Instruments

UA79M12MJGB by Texas Instruments

UA79M12MJGB by Texas Instruments is a -12V fixed voltage regulator with 0.5A output current and 2.3V dropout voltage, suitable for applications requiring precise power supply regulation. It features a ceramic package body material, bipolar technology, and operates within a temperature range of -55 to 150°C. Ideal for through-hole mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,461 parts In-Stock

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4,461

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Digiode

USA . 1,217 parts In-Stock

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1,217

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Manoshevitz Elec. Sales

Israel . 10 parts In-Stock

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10

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Freelance Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,591 parts In-Stock

1+ parts

$2.281

100+ parts

-

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$2.781

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1,591

$2.281

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$2.781

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DigiPath Technology Company

USA . 2,359 parts In-Stock

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$2.512

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2,359

$2.512

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IDEA Electronic Components Group

UK . 2,002 parts In-Stock

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$2.563

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$2.307

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2,002

$2.563

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$2.307

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ChromeModa Solutions

Germany . 1,560 parts In-Stock

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$2.563

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$2.102

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$2.563

$2.102

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One Stop Electronics

USA . 188 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 230 parts In-Stock

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$19.500

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Corphita

USA . 211 parts In-Stock

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Overview

Power up your projects with the UA79M12MJGB by Texas Instruments, the leading manufacturer of high-quality electronic components. This versatile Other Function Regulator is designed to deliver reliable performance in a variety of applications. With its fixed adjustability and precise voltage regulation, this component ensures stable power supply for your devices. Trust Texas Instruments for superior technology and enhance the efficiency of your systems with the UA79M12MJGB.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent thermal conductivity and heat dissipation, ensuring stable performance and reliability even in high temperature environments.

Operating Temperature (TJ-Max): 150 °C

With a high maximum operating temperature, this regulator can function effectively in a wide range of temperature conditions, making it suitable for various applications.

Screening Level: 38535Q/M;38534H;883B

This screening level ensures that the product meets stringent quality standards and undergoes thorough testing, guaranteeing reliable and consistent performance.

Technology: BIPOLAR

Bipolar technology provides precise regulation and low noise output, making this regulator ideal for applications where stability and accuracy are crucial.

Maximum Output Current-1: 0.5 A

With a maximum output current of 0.5 A, this regulator can power a variety of devices with moderate power requirements, offering versatility in usage.

Technical Specifications

Other Function Regulators UA79M12MJGB attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

2.3 V

Maximum Input Voltage Absolute:

JESD-30 Code:

R-XDIP-T8

Maximum Line Regulation:

.08 %

Maximum Load Regulation:

.24 %

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

.5 A

Nominal Output Voltage-1:

-12 V

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Qualification Status:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

5 %

Trade Compliance

UA79M12MJGB Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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