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UA78M10MJG/883B

Texas Instruments

UA78M10MJG/883B by Texas Instruments

UA78M10MJG/883B by Texas Instruments is a ceramic package regulator with 10V output voltage, 0.5A output current, and -55 to 150°C operating temperature range. It is ideal for military applications due to MIL-STD-883 Class B screening level and bipolar technology, offering precise voltage regulation in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,961 parts In-Stock

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Digiode

USA . 2,253 parts In-Stock

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AZTECH Wire

Italy . 232 parts In-Stock

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$5.146

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$5.146

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Parana Technologies

USA . 1,157 parts In-Stock

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$7.244

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$7.746

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$7.244

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$7.746

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DigiPath Technology Company

USA . 761 parts In-Stock

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$7.976

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$7.338

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761

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$7.338

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ChromeModa Solutions

Germany . 3,835 parts In-Stock

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$8.139

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$6.674

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3,835

$8.139

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IDEA Electronic Components Group

UK . 1,434 parts In-Stock

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$8.139

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$7.325

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Ampacity Inc.

Singapore . 1,260 parts In-Stock

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$9.500

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One Stop Electronics

USA . 134 parts In-Stock

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$9.500

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Semicontronic

India . 379 parts In-Stock

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$17.500

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$17.062

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$16.975

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Corphita

USA . 4,343 parts In-Stock

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Corohmni

South Africa . 426 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the UA78M10MJG/883B regulator. This product is designed to provide exceptional performance and stability for a wide range of applications. From industrial to military, this regulator offers precise voltage control and efficient power management. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, ensuring that your projects run smoothly and efficiently. Join countless satisfied customers who have discovered the value and benefits of using Texas Instruments products.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer high thermal conductivity, making them suitable for high-temperature applications and providing better reliability.

Operating Temperature (TJ-Max): 150 °C

With a high maximum operating temperature, this regulator can withstand harsh environmental conditions and maintain stable performance.

Screening Level: MIL-STD-883 Class B (Modified)

MIL-STD-883 Class B screening ensures that the regulator meets strict quality standards and is suitable for use in military and aerospace applications.

Technology: BIPOLAR

Bipolar technology ensures precise and stable voltage regulation, making this regulator reliable for various applications.

Nominal Output Voltage-1: 10 V

With a nominal output voltage of 10 V, this regulator is suitable for applications requiring a stable and regulated output voltage.

Maximum Output Current-1: 0.5 A

The maximum output current of 0.5 A allows this regulator to power moderate loads efficiently and reliably.

Maximum Input Voltage Absolute: 35 V

With a high maximum input voltage of 35 V, this regulator can handle varying input voltages without risk of damage.

Technical Specifications

Other Function Regulators UA78M10MJG/883B attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

2.5 V

Maximum Input Voltage Absolute:

JESD-30 Code:

R-XDIP-T8

Maximum Line Regulation:

.06 %

Maximum Load Regulation:

.1 %

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

.5 A

Nominal Output Voltage-1:

10 V

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Qualification Status:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

5 %

Trade Compliance

UA78M10MJG/883B Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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