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TX810EVM

Texas Instruments

TX810EVM by Texas Instruments

TX810EVM by Texas Instruments is an 8-channel (Octal) transceiver interface board for TX810 IC. It falls under the category of Development Boards, Kits, Programmers and comes in a box package. Ideal for evaluation and demonstration purposes with MSL level 1.

Median Price

$206.640

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$206.640

100+ parts

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2

$206.640

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Distributors (In-Stock)

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Vyrian

USA . 7,005 parts In-Stock

1+ parts

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7,005

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Digiode

USA . 2,821 parts In-Stock

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2,821

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 528 parts In-Stock

1+ parts

$8.909

100+ parts

-

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528

$8.909

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One Stop Electronics

USA . 1,588 parts In-Stock

1+ parts

$53.100

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1,588

$53.100

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Semicontronic

India . 301 parts In-Stock

1+ parts

$121.100

100+ parts

$118.072

1k+ parts

$117.467

10k+ parts

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301

$121.100

$118.072

$117.467

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ChromeModa Solutions

Germany . 2,086 parts In-Stock

1+ parts

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2,086

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Parana Technologies

USA . 1,729 parts In-Stock

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$1.260

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1,729

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$1.260

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Corphita

USA . 913 parts In-Stock

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913

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IDEA Electronic Components Group

UK . 504 parts In-Stock

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504

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Corohmni

South Africa . 235 parts In-Stock

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235

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DigiPath Technology Company

USA . 230 parts In-Stock

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230

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Overview

Enhance your development projects with the TX810EVM by Texas Instruments, a top-quality interface transceiver board that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this 8-channel (octal) evaluation board is perfect for a wide range of applications in various industries. With its innovative design and cutting-edge technology, the TX810EVM provides customers with exceptional value, benefits, and advantages, making it a must-have tool for any project requiring superior communication capabilities. Upgrade your development process today with the TX810EVM and experience the difference for yourself!

Feature Benefit Bullets

Other Names: 296-31334, TX810EVM-ND

Easy to search and identify the product with multiple names, increasing accessibility for potential users.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Designed for development and evaluation purposes, making it suitable for testing and prototyping.

Package: Box

Comes in a secure packaging that protects the product during shipping and storage.

Type: Interface

Facilitates communication between devices, making it an essential component for various applications.

Function: Transceiver

Enables both transmitting and receiving data, enhancing the product's versatility and usability.

Utilized IC / Part: TX810

Specifically designed to work with TX810, ensuring optimal performance and compatibility.

Primary Attributes: 8-Channel (Octal)

Offers multiple channels for increased functionality or connectivity, making it suitable for complex systems.

Supplied Contents: Board(s)

Includes essential components for immediate use, saving time and effort in assembly.

Base Product Number: TX810

Part of the TX810 product line, ensuring consistency in quality and features across related products.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be exposed to various levels of moisture without risk of damage, increasing durability and reliability.

Technical Specifications

Additional Parts TX810EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-31334
TX810EVM-ND

Function:

Transceiver

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TX810

Package:

Box

Embedded:

No

Primary Attributes:

8-Channel (Octal)

Standard Package:

1

Base Product Number:

TX810

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TX810EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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