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TUSB7340EVM

Texas Instruments

TUSB7340EVM by Texas Instruments

TUSB7340EVM by Texas Instruments is an Evaluation Board for the USB interface. It features PCI Express X1 Standard Height, making it suitable for development and testing purposes. The package includes board(s) and supports the TUSB7340 IC, ideal for evaluating USB connectivity solutions.

Median Price

$238.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5 parts In-Stock

1+ parts

$238.800

100+ parts

-

1k+ parts

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5

$238.800

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Distributors (In-Stock)

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Vyrian

USA . 6,383 parts In-Stock

1+ parts

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6,383

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Digiode

USA . 2,541 parts In-Stock

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2,541

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$6.704

100+ parts

-

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798

$6.704

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Ampacity Inc.

Singapore . 1,183 parts In-Stock

1+ parts

$68.100

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-

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1,183

$68.100

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Component Stockers USA

USA . 724 parts In-Stock

1+ parts

$99.990

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724

$99.990

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Semicontronic

India . 1,038 parts In-Stock

1+ parts

$123.100

100+ parts

$120.022

1k+ parts

$119.407

10k+ parts

-

1,038

$123.100

$120.022

$119.407

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One Stop Electronics

USA . 721 parts In-Stock

1+ parts

$209.100

100+ parts

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721

$209.100

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ChromeModa Solutions

Germany . 4,070 parts In-Stock

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4,070

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IDEA Electronic Components Group

UK . 2,236 parts In-Stock

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2,236

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DigiPath Technology Company

USA . 1,598 parts In-Stock

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1,598

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Corphita

USA . 1,485 parts In-Stock

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1,485

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Parana Technologies

USA . 690 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$1.261

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690

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$1.261

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Corohmni

South Africa . 377 parts In-Stock

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377

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Perfect Parts

USA . 6 parts In-Stock

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6

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Overview

Unlock the full potential of your USB interface with the TUSB7340EVM by Texas Instruments. This top-notch evaluation board offers unparalleled quality and reliability, thanks to the trusted manufacturer behind it. Perfect for development projects, this interface board provides seamless integration and enhanced performance. Experience the benefits of PCI Express X1 Standard Height functionality and elevate your USB projects to new heights. Upgrade your setup today with the TUSB7340EVM and see the difference for yourself.

Feature Benefit Bullets

Other Names: TUSB7340EVM-ND / 296-29220

Makes it easy to identify and order the correct product

Category: Development Boards, Kits, Programmers / Evaluation Boards

Designed for development and evaluation purposes

Package: Box

Provides protection and organization for the product and its components

Type: Interface

Allows for easy connection and communication with other devices

Function: USB

Enables high-speed data transfer and power delivery

Utilized IC / Part: TUSB7340

Utilizes a specific integrated circuit for USB functionality

Primary Attributes: PCI Express X1 Standard Height

Compatible with standard hardware interfaces for easy integration

Supplied Contents: Board(s)

Includes all necessary components for immediate use

Base Product Number: TUSB734

Part of a series of products for various USB applications

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and used in various environmental conditions without risk of damage

Technical Specifications

Additional Parts TUSB7340EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TUSB7340EVM-ND
296-29220

Function:

USB

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TUSB7340

Package:

Box

Embedded:

No

Primary Attributes:

PCI Express X1 Standard Height

Standard Package:

1

Base Product Number:

TUSB734

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TUSB7340EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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