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TUSB7320EVM

Texas Instruments

TUSB7320EVM by Texas Instruments

TUSB7320EVM by Texas Instruments is an Evaluation Board for USB interface. It features PCI Express X1 Standard Height, ideal for testing TUSB7320 IC. The kit includes board(s) and is designed for Development Boards, Kits, Programmers applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,735 parts In-Stock

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Digiode

USA . 771 parts In-Stock

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771

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Distributors (Availability)

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AZTECH Wire

Italy . 272 parts In-Stock

1+ parts

$15.753

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272

$15.753

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One Stop Electronics

USA . 734 parts In-Stock

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$37.100

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734

$37.100

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Ampacity Inc.

Singapore . 654 parts In-Stock

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$203.100

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654

$203.100

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Semicontronic

India . 610 parts In-Stock

1+ parts

$241.100

100+ parts

$235.072

1k+ parts

$233.867

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610

$241.100

$235.072

$233.867

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ChromeModa Solutions

Germany . 2,149 parts In-Stock

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2,149

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Parana Technologies

USA . 1,987 parts In-Stock

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$0.928

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1,987

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$0.928

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IDEA Electronic Components Group

UK . 1,683 parts In-Stock

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1,683

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DigiPath Technology Company

USA . 176 parts In-Stock

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176

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Corphita

USA . 131 parts In-Stock

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131

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Corohmni

South Africa . 54 parts In-Stock

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54

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Perfect Parts

USA . 8 parts In-Stock

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Overview

The Texas Instruments TUSB7320EVM offers top-notch quality and reliability, backed by the trusted reputation of its manufacturer. This USB interface development board provides unparalleled value and benefits for customers looking to enhance their products with cutting-edge technology. Ideal for a wide range of applications, this PCI Express X1 standard height board is sure to meet your connectivity needs with ease. Experience the advantage of seamless integration and improved performance with the TUSB7320EVM.

Feature Benefit Bullets

Other Names: TUSB7320EVM-ND, 296-29881

Provides multiple reference names for easy identification and ordering

Category: Development Boards, Kits, Programmers, Evaluation Boards

Clearly indicates the purpose and use of the product

Type: Interface

Designed specifically for USB interface applications

Function: USB

Focused on USB connectivity and functionality

Utilized IC / Part: TUSB7320

Utilizes a specific IC for efficient performance

Primary Attributes: PCI Express X1 Standard Height

Compatible with PCI Express X1 Standard Height slots for easy integration

Supplied Contents: Board(s)

Includes necessary board(s) for evaluation and demonstration

Base Product Number: TUSB732

Part of a designated product line for ease of compatibility

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Provides flexibility in storage and handling without moisture concerns

Technical Specifications

Additional Parts TUSB7320EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TUSB7320EVM-ND
296-29881

Function:

USB

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TUSB7320

Package:

Box

Embedded:

No

Primary Attributes:

PCI Express X1 Standard Height

Standard Package:

1

Base Product Number:

TUSB732

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TUSB7320EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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