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TSL261

Texas Instruments

TSL261 by Texas Instruments

TSL261 by Texas Instruments is a 1.5mm linear output photo IC sensor with single configuration. Operating from -25 to 85°C, it has a supply voltage range of 3-5V and can handle up to 0.01A current. Ideal for applications requiring IR sensing in through-hole mounting setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,773 parts In-Stock

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Vyrian

USA . 2,368 parts In-Stock

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2,368

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Lakeland Logistics Inc

USA . 191 parts In-Stock

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191

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Bristol Electronics

USA . 191 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,792 parts In-Stock

1+ parts

$0.411

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$1.592

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1,792

$0.411

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$1.592

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ChromeModa Solutions

Germany . 1,178 parts In-Stock

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$0.462

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$0.379

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$0.462

$0.379

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IDEA Electronic Components Group

UK . 553 parts In-Stock

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$0.462

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$0.416

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553

$0.462

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$0.416

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AZTECH Wire

Italy . 754 parts In-Stock

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$5.479

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754

$5.479

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One Stop Electronics

USA . 545 parts In-Stock

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$16.100

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$16.100

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Corphita

USA . 1,457 parts In-Stock

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DigiPath Technology Company

USA . 1,422 parts In-Stock

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$0.417

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Overview

Enhance your projects with the TSL261 Photo IC Sensor from Texas Instruments. With a compact size and superior performance, this sensor offers precise measurements and reliable data for a wide range of applications. From robotics to industrial automation, this sensor is the perfect solution for your needs. Trust in Texas Instruments' reputation for quality and innovation to deliver exceptional results every time. Upgrade your projects today with the TSL261 Photo IC Sensor and experience the difference it can make.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration simplifies installation and integration, making it easier to use in various applications.

Size: 1.5 mm

Compact size allows for easy placement in confined spaces or small devices.

Optoelectronic Type: LINEAR OUTPUT PHOTO IC

Linear output provides accurate and continuous measurement data, making it ideal for precise detection and control applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for operation in energy-efficient systems or battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in elevated temperature environments.

Shape: RECTANGULAR

Rectangular shape offers versatile mounting options and easy integration into different device designs.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature ensures functionality in cold environments or during temperature fluctuations.

Infrared (IR) Range: YES

Infrared capability enables detection and sensing of objects in dark or low-light conditions, expanding the sensor's utility.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage compatibility allows for easy integration into existing systems or projects.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature offers secure and stable installation, preventing dislodging or misalignment during operation.

Maximum On State Current: 0.01 A

Low maximum on-state current consumption ensures energy efficiency and prevents overheating during prolonged use.

Technical Specifications

Photo IC Sensors TSL261 attributes and parameters. Explore more Photo IC Sensors devices from Texas Instruments

Specs

Application:

GENERAL PURPOSE

Configuration:

SINGLE

Infrared (IR) Range:

YES

Mounting Feature:

No. of Functions:

1

Maximum On State Current:

.01 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Optoelectronic Type:

Shape:

RECTANGULAR

Size:

1.5 mm

Sub-Category:

Photo ICs

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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