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TSL220

Texas Instruments

TSL220 by Texas Instruments

TSL220 by Texas Instruments is a SINGLE linear output photo IC sensor with 8 terminals. It operates at -25 to 70°C, requires 4V supply voltage, and draws max 10mA current. Ideal for applications requiring IR sensing in a compact 8.95mm rectangular package with through-hole mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,412 parts In-Stock

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Digiode

USA . 1,680 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 31 parts In-Stock

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Holdelec - ElecDif-Pro

France . 31 parts In-Stock

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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Pegasus Components GmbH

Germany . 10 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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Parana Technologies

USA . 1,505 parts In-Stock

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$0.317

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$1.553

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$0.317

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$1.553

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DigiPath Technology Company

USA . 2,239 parts In-Stock

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$0.349

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$0.321

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$0.349

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ChromeModa Solutions

Germany . 6,115 parts In-Stock

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$0.356

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$0.292

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IDEA Electronic Components Group

UK . 739 parts In-Stock

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$0.356

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$0.320

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AZTECH Wire

Italy . 720 parts In-Stock

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$17.990

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One Stop Electronics

USA . 618 parts In-Stock

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$19.100

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Corphita

USA . 4,853 parts In-Stock

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Assy Fe

Spain . 6 parts In-Stock

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Overview

Enhance your photodetection applications with the TSL220 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments guarantees quality and reliability in every product they deliver. The TSL220 is a versatile Photo IC Sensor that provides precise linear output, making it ideal for a wide range of optoelectronic applications. With a compact size and easy installation, this sensor offers customers exceptional value and performance. Upgrade your projects with the TSL220 and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Configuration: SINGLE

A single configuration simplifies the setup process and reduces the chances of errors in installation, making it user-friendly.

Size: 8.95 mm

Compact size allows for easy integration into various devices without taking up much space, making it versatile for different applications.

Optoelectronic Type: LINEAR OUTPUT PHOTO IC

Linear output provides accurate and precise measurement data, making it suitable for applications that require high performance and reliability.

No. of Terminals: 8

Having 8 terminals allows for more connection options and flexibility in use, enhancing the usability of the product.

Minimum Supply Voltage: 4 V

Low minimum supply voltage requirements help in reducing power consumption, making the product energy-efficient.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions, increasing the product's durability.

Shape: RECTANGULAR

Rectangular shape provides easy mounting and fitting into various devices, enhancing the product's compatibility and ease of use.

Minimum Operating Temperature: -25 °C

With a low minimum operating temperature, the product can operate in cold environments without any performance issues, increasing its versatility.

Infrared (IR) Range: YES

Having an infrared range expands the product's capabilities to detect infrared light, making it suitable for applications that require sensing in this spectrum.

Maximum Supply Current: 10 mA

Low maximum supply current consumption helps in efficient power usage, ensuring longer battery life and reduced operating costs.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature simplifies the installation process and provides a secure connection, making it ideal for applications requiring stable and reliable mounting.

Technical Specifications

Photo IC Sensors TSL220 attributes and parameters. Explore more Photo IC Sensors devices from Texas Instruments

Specs

Application:

GENERAL PURPOSE

Configuration:

SINGLE

Infrared (IR) Range:

YES

Mounting Feature:

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Optoelectronic Type:

Shape:

RECTANGULAR

Size:

8.95 mm

Sub-Category:

Photo ICs

Maximum Supply Current:

10 mA

Minimum Supply Voltage:

4 V

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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