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TS5L100DBQRG4

Texas Instruments

TS5L100DBQRG4 by Texas Instruments

TS5L100DBQRG4 by Texas Instruments is a 16-terminal SPDT switch with 4 functions, operating at 6.2V. With a max on-state resistance of 19 ohm and switching time of 7ns, it's ideal for applications requiring fast and efficient signal routing in commercial-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,163 parts In-Stock

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Digiode

USA . 3,671 parts In-Stock

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3,671

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 284 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

284

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 133 parts In-Stock

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$1.500

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133

$1.500

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One Stop Electronics

USA . 1,511 parts In-Stock

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$6.500

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1,511

$6.500

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AZTECH Wire

Italy . 811 parts In-Stock

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$7.698

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811

$7.698

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Parana Technologies

USA . 1,972 parts In-Stock

1+ parts

$12.383

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$12.822

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1,972

$12.383

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$12.822

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DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

$13.636

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$12.545

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1,715

$13.636

$12.545

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IDEA Electronic Components Group

UK . 1,615 parts In-Stock

1+ parts

$13.914

100+ parts

$13.218

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$12.523

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1,615

$13.914

$13.218

$12.523

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ChromeModa Solutions

Germany . 1,388 parts In-Stock

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$13.914

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$11.409

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$11.409

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Microchip USA

USA . 2,343 parts In-Stock

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Corphita

USA . 1,018 parts In-Stock

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Corohmni

South Africa . 138 parts In-Stock

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Overview

Upgrade your electronic circuits with the TS5L100DBQRG4 by Texas Instruments, a top-quality multiplexer and switch designed to enhance performance and reliability. Crafted with precision using durable plastic/epoxy materials, this versatile component offers seamless switching between 4 functions with separate outputs for maximum efficiency. Ideal for a wide range of applications, this small outline, shrink pitch device guarantees superior functionality with a nominal bandwidth of 350 kHz and a maximum on-state resistance of 19 ohms. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards.

No. of Functions: 4

Offers versatility and capability to handle multiple functions simultaneously.

Nominal Supply Voltage (Vsup): 6.2 V

Provides a stable and reliable power source for the device to operate effectively.

Maximum Operating Temperature: 70 °C

Ensures that the device can function reliably even under high temperature conditions.

Minimum Operating Temperature: 0 °C

Allows the device to operate in a wide range of temperature environments.

Nominal Bandwidth: 350 kHz

Offers a high bandwidth for efficient data transmission.

Maximum On-state Resistance (Ron): 19 ohm

Provides low resistance for smooth signal transmission.

Maximum Switch-on Time: 7 ns

Offers quick switching response for efficient performance.

Technical Specifications

Multiplexers & Switches TS5L100DBQRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

350 kHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

Normal Position (V):

NO/NC

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

1 ohm

Maximum On-state Resistance (Ron):

19 ohm

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.2

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.1 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.003 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

6.2 V

Surface Mount:

YES

Maximum Switch-off Time:

4 ns

Maximum Switch-on Time:

7 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TS5L100DBQRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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