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TRS3243CDB

Texas Instruments

TRS3243CDB by Texas Instruments

TRS3243CDB by Texas Instruments is a Line Driver & Receiver with 5 functions, operating at 3.6V max supply voltage. It has a transmit delay of 150ns and is ideal for EIA-232-F, TIA-232-F, V.28 interface standards in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,479

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-

-

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Digiode

USA . 390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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390

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 565 parts In-Stock

1+ parts

$1.792

100+ parts

-

1k+ parts

$2.352

10k+ parts

-

565

$1.792

-

$2.352

-

DigiPath Technology Company

USA . 1,582 parts In-Stock

1+ parts

$1.973

100+ parts

$1.815

1k+ parts

-

10k+ parts

-

1,582

$1.973

$1.815

-

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ChromeModa Solutions

Germany . 6,166 parts In-Stock

1+ parts

$2.013

100+ parts

$1.651

1k+ parts

-

10k+ parts

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6,166

$2.013

$1.651

-

-

IDEA Electronic Components Group

UK . 1,120 parts In-Stock

1+ parts

$2.013

100+ parts

-

1k+ parts

$1.812

10k+ parts

-

1,120

$2.013

-

$1.812

-

AZTECH Wire

Italy . 294 parts In-Stock

1+ parts

$5.860

100+ parts

-

1k+ parts

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10k+ parts

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294

$5.860

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-

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Ampacity Inc.

Singapore . 854 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

-

10k+ parts

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854

$14.500

-

-

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One Stop Electronics

USA . 374 parts In-Stock

1+ parts

$46.500

100+ parts

-

1k+ parts

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374

$46.500

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Corphita

USA . 1,968 parts In-Stock

1+ parts

-

100+ parts

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1,968

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Microchip USA

USA . 1,660 parts In-Stock

1+ parts

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100+ parts

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1,660

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Overview

Unlock seamless communication with the TRS3243CDB by Texas Instruments. Manufactured by industry leader Texas Instruments, this line driver and receiver offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides customers with efficient and effective communication solutions. With its advanced technology and top-notch performance, the TRS3243CDB ensures that you stay connected without any hassle. Experience the value, benefits, and advantages of this exceptional product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

This allows for compatibility with a wide range of power sources, making it versatile for various applications.

No. of Functions: 5

Having multiple functions in one device saves on cost and board space, making it an efficient choice for multi-purpose applications.

Maximum Transmit Delay: 150 ns

Low transmit delay ensures quick and efficient data transmission, making it suitable for real-time applications.

Technical Specifications

Line Drivers & Receivers TRS3243CDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

12.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

150 ns

Width:

5.3 mm

Trade Compliance

TRS3243CDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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