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TRS3238CDBR

Texas Instruments

TRS3238CDBR by Texas Instruments

TRS3238CDBR by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. Ideal for EIA-232-F, TIA-232-F, V.28 interfaces, it features a small outline package style and Schmitt trigger input characteristics. With a max output low current of 1.6A, this IC is suitable for commercial temperature grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,470 parts In-Stock

1+ parts

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3,470

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Vyrian

USA . 2,652 parts In-Stock

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2,652

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Distributors (Availability)

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AZTECH Wire

Italy . 609 parts In-Stock

1+ parts

$7.692

100+ parts

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609

$7.692

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Parana Technologies

USA . 2,115 parts In-Stock

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$12.541

100+ parts

-

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$12.993

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2,115

$12.541

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$12.993

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DigiPath Technology Company

USA . 1,430 parts In-Stock

1+ parts

$13.809

100+ parts

$12.704

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1,430

$13.809

$12.704

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ChromeModa Solutions

Germany . 1,735 parts In-Stock

1+ parts

$14.091

100+ parts

$11.555

1k+ parts

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1,735

$14.091

$11.555

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IDEA Electronic Components Group

UK . 1,619 parts In-Stock

1+ parts

$14.091

100+ parts

$13.386

1k+ parts

$12.682

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1,619

$14.091

$13.386

$12.682

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One Stop Electronics

USA . 1,367 parts In-Stock

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$29.500

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1,367

$29.500

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Component Stockers USA

USA . 414 parts In-Stock

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$99.990

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414

$99.990

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A-Z Elektronik GmbH

Germany . 13,826 parts In-Stock

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13,826

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Corphita

USA . 297 parts In-Stock

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Microchip USA

USA . 262 parts In-Stock

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Overview

Enhance your electronic projects with the TRS3238CDBR by Texas Instruments. This high-quality Line Driver & Receiver offers unmatched performance and reliability. Designed by a reputable manufacturer, this product is perfect for a wide range of applications. Customers can expect exceptional value, benefits, and advantages when using this versatile component. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Upgrade your projects today with the TRS3238CDBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with a wide range of systems and devices.

No. of Functions: 3

Offers versatility and flexibility in signal processing capabilities.

Package Shape: RECTANGULAR

Allows for compact and efficient use of space on circuit boards.

Power Supplies (V): 3.3/5

Provides flexibility in power options for different applications.

No. of Terminals: 28

Offers ample connections for various input and output requirements.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Facilitates high-density mounting and space-saving design.

Maximum High Level Input Current: 0.000001 Amp

Allows for efficient signal processing with low power consumption.

Minimum Supply Voltage: 3 V

Ensures stable performance within the specified voltage range.

Maximum Operating Temperature: 70 °C

Suitable for operation in a wide range of temperature environments.

Minimum Operating Temperature: 0 °C

Can function effectively even in low-temperature conditions.

Terminal Position: DUAL

Provides flexibility in connection options for different applications.

Maximum Seated Height: 2 mm

Allows for compact and space-efficient installation on circuit boards.

Width: 5.3 mm

Compact design for space-saving installation.

Maximum Output Low Current: 1.6 Amp

Capable of driving output devices with sufficient current.

Receiver No. of Bits: 3

Provides accurate data reception and processing with multiple bits.

Length: 10.2 mm

Compact size for efficient use of space on circuit boards.

Minimum Out Swing: 10 V

Ensures reliable signal swing for robust communication.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Maximum Receive Delay: 150 ns

Fast data reception and processing for real-time applications.

Terminal Form: GULL WING

Provides secure and reliable terminal connections.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Complies with industry standards for seamless integration into existing systems.

Maximum Supply Current: 2 mA

Low power consumption for energy-efficient operation.

Input Characteristics: SCHMITT TRIGGER

Enhanced noise immunity and signal stability for reliable operation.

Nominal Supply Voltage: 3.3 V

Optimal operating voltage for efficient performance.

Terminal Pitch: 0.65 mm

Allows for fine-pitch connections for compact design.

Driver No. of Bits: 5

Enhanced data transmission capabilities with multiple bits.

Interface IC Type: LINE TRANSCEIVER

Facilitates bidirectional communication between devices.

Technical Specifications

Line Drivers & Receivers TRS3238CDBR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

5

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRS3238CDBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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