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TRS3223ECDB

Texas Instruments

TRS3223ECDB by Texas Instruments

TRS3223ECDB by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.6V max supply voltage. Ideal for EIA-232-F, TIA-232-F, V.28 interfaces in commercial temperature grade applications. Package style: Small Outline, Shrink Pitch; Terminal finish: Nickel Palladium Gold; Input characteristics: Schmitt Trigger.

Median Price

$1.608

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,794 parts In-Stock

1+ parts

-

100+ parts

$1.580

1k+ parts

$1.310

10k+ parts

$1.170

1,794

-

$1.580

$1.310

$1.170

Verical

USA . 1,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.637

10k+ parts

$1.462

1,220

-

-

$1.637

$1.462

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,491 parts In-Stock

1+ parts

$1.226

100+ parts

-

1k+ parts

-

10k+ parts

-

2,491

$1.226

-

-

-

Vyrian

USA . 2,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,167

-

-

-

-

DigiKey Marketplace

USA . 2,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,130

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,227 parts In-Stock

1+ parts

$1.161

100+ parts

-

1k+ parts

-

10k+ parts

-

4,227

$1.161

-

-

-

Parana Technologies

USA . 2,018 parts In-Stock

1+ parts

$8.325

100+ parts

$773.108

1k+ parts

$7.493

10k+ parts

-

2,018

$8.325

$773.108

$7.493

-

DigiPath Technology Company

USA . 181 parts In-Stock

1+ parts

$9.167

100+ parts

$8.434

1k+ parts

-

10k+ parts

-

181

$9.167

$8.434

-

-

ChromeModa Solutions

Germany . 6,327 parts In-Stock

1+ parts

$9.354

100+ parts

$7.670

1k+ parts

-

10k+ parts

-

6,327

$9.354

$7.670

-

-

IDEA Electronic Components Group

UK . 1,395 parts In-Stock

1+ parts

$9.354

100+ parts

$8.886

1k+ parts

$8.419

10k+ parts

-

1,395

$9.354

$8.886

$8.419

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

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Microchip USA

USA . 198 parts In-Stock

1+ parts

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100+ parts

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198

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Kepictronics

USA . 50 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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50

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Overview

Elevate your electronic designs with the TRS3223ECDB by Texas Instruments, a top-tier manufacturer known for superior quality and innovation. As a line driver and receiver, this product offers unmatched reliability and performance for a wide range of applications. With a compact package design and dual terminal position, this device provides seamless integration and ease of use. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your projects. Choose the TRS3223ECDB for unparalleled value and benefits that will elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount design allows for easy installation and integration into existing systems.

Maximum Supply Voltage: 3.6 V

Can handle a maximum supply voltage of 3.6 V, making it compatible with a variety of systems.

No. of Functions: 2

Offers multiple functions in a single device, providing cost-effective solutions.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and space-saving design.

Power Supplies (V): 3.3/5

Supports multiple power supply options for flexibility in different applications.

No. of Terminals: 20

Provides a sufficient number of terminals for connectivity and compatibility with various systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch design make it suitable for applications where space is limited.

Maximum High Level Input Current: 0.000001 Amp

Low input current ensures energy efficiency and reduces power consumption.

Minimum Supply Voltage: 3 V

Can operate at a minimum supply voltage of 3 V, enhancing compatibility with different systems.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connectivity options.

Maximum Seated Height: 2 mm

Low seated height makes it suitable for compact and slim device designs.

Width: 5.3 mm

Narrow width allows for easy integration into tightly packed systems.

Maximum Output Low Current: 1.6 Amp

High output low current capability ensures reliable performance and power efficiency.

Receiver No. of Bits: 2

2 bits receiver allows for data transmission and reception of multiple signals.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds, ensuring reliability during soldering.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and assembly.

Length: 7.2 mm

Compact length makes it suitable for applications with limited space.

Minimum Out Swing: 10 V

Minimum out swing of 10 V ensures accurate voltage swings for data transmission.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data transmission and reception.

Terminal Form: GULL WING

Gull wing terminal form provides secure connection and easy soldering.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with multiple interface standards ensures compatibility with different systems.

Maximum Supply Current: 1 mA

Low supply current requirement for efficient power usage.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity and reliable signal detection.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V ensures stable operation within specified limits.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for high-density mounting and space-saving designs.

Driver No. of Bits: 2

2 bits driver allows for the transmission of multiple signals with high accuracy.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type ensures efficient data transmission and reception in communication systems.

Technical Specifications

Line Drivers & Receivers TRS3223ECDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TRS3223ECDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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