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TRS3222CPWG4

Texas Instruments

TRS3222CPWG4 by Texas Instruments

TRS3222CPWG4 by Texas Instruments is a Line Driver & Receiver with 20 terminals, operating at 3.3/5V. It features EIA-232-F interface standard, Schmitt trigger input characteristics, and dual terminal position. Ideal for applications requiring reliable data transmission in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,523 parts In-Stock

1+ parts

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4,523

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Digiode

USA . 4,467 parts In-Stock

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4,467

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 790 parts In-Stock

1+ parts

$6.980

100+ parts

-

1k+ parts

$7.553

10k+ parts

-

790

$6.980

-

$7.553

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IDEA Electronic Components Group

UK . 1,984 parts In-Stock

1+ parts

$7.843

100+ parts

-

1k+ parts

$7.059

10k+ parts

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1,984

$7.843

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$7.059

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ChromeModa Solutions

Germany . 1,113 parts In-Stock

1+ parts

$7.843

100+ parts

$6.431

1k+ parts

-

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1,113

$7.843

$6.431

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AZTECH Wire

Italy . 340 parts In-Stock

1+ parts

$9.744

100+ parts

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340

$9.744

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One Stop Electronics

USA . 455 parts In-Stock

1+ parts

$12.500

100+ parts

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455

$12.500

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Corphita

USA . 4,562 parts In-Stock

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4,562

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DigiPath Technology Company

USA . 2,052 parts In-Stock

1+ parts

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100+ parts

$7.071

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2,052

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$7.071

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Microchip USA

USA . 151 parts In-Stock

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151

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Overview

Experience the reliability and precision of Texas Instruments with the TRS3222CPWG4 Line Drivers & Receivers. This product offers top-notch quality and performance in a compact package, making it ideal for a wide range of applications. With a maximum supply voltage of 3.6V and dual functionality, this line driver & receiver ensures seamless communication and efficient operation. Trust Texas Instruments to deliver excellence in every aspect, providing you with the value and benefits you need for your projects. Upgrade your systems with the TRS3222CPWG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the components inside, ensuring reliability and longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V makes the product versatile and compatible with a wide range of power sources.

No. of Functions: 2

Having multiple functions in a single device increases efficiency and saves space on the circuit board, making the product a cost-effective choice.

Package Shape: RECTANGULAR

Rectangular package shape is standardized and easy to handle, allowing for seamless integration into various electronic systems.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages gives flexibility in design and compatibility with different types of systems.

No. of Terminals: 20

Having a higher number of terminals allows for more connectivity options and versatility in use.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space and is ideal for applications where size constraints are important.

Maximum High Level Input Current: 0.000001 Amp

Low high level input current ensures energy efficiency and helps in reducing power consumption.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows the product to be used in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function in cold environments without any performance issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures stable connections for improved reliability.

Maximum Seated Height: 1.2 mm

Low seated height helps in saving space and is beneficial for applications where height restrictions are important.

Width: 4.4 mm

Narrow width makes the product suitable for compact designs and applications where space is limited.

Maximum Output Low Current: 1.6 Amp

High maximum output low current capacity allows the product to drive larger loads without overheating or overloading.

Receiver No. of Bits: 2

Having 2 bits for the receiver ensures accurate data transmission and reception, making the product reliable in communication applications.

Length: 6.5 mm

Compact length makes the product suitable for applications where size constraints are important.

Minimum Out Swing: 10 V

Having a minimum out swing of 10 V ensures strong signal transmission and reception, making the product reliable in communication applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the product can operate within standard temperature ranges in commercial applications.

Maximum Receive Delay: 0 ns

Zero maximum receive delay ensures real-time data transmission and reception, making the product suitable for high-speed communication applications.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connection and ease of soldering during installation.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Support for various interface standards ensures compatibility with different communication protocols and devices.

Maximum Supply Current: 1 mA

Low maximum supply current ensures energy efficiency and helps in reducing power consumption.

Input Characteristics: SCHMITT TRIGGER

Having Schmitt trigger input characteristics ensures noise immunity and stable signal processing, enhancing the product's performance in noisy environments.

Nominal Supply Voltage: 3.3 V

Support for a nominal supply voltage of 3.3 V ensures compatibility with standard power sources in electronic systems.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for dense packing and space-saving on the circuit board.

Driver No. of Bits: 2

Having 2 bits for the driver ensures accurate data transmission and reception, making the product reliable in communication applications.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver interface IC type, the product can efficiently transmit and receive data on communication lines, making it suitable for communication applications.

Technical Specifications

Line Drivers & Receivers TRS3222CPWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRS3222CPWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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