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TRS222CDW

Texas Instruments

TRS222CDW by Texas Instruments

TRS222CDW by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 5V. It has a max transmit delay of 3500ns and can handle high level input current of 0.00004A. Ideal for EIA-232-F, TIA-232-F, V.28 interfaces in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,178 parts In-Stock

1+ parts

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5,178

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Digiode

USA . 2,472 parts In-Stock

1+ parts

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2,472

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$7.042

100+ parts

-

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845

$7.042

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Parana Technologies

USA . 634 parts In-Stock

1+ parts

$8.160

100+ parts

-

1k+ parts

$8.760

10k+ parts

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634

$8.160

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$8.760

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DigiPath Technology Company

USA . 2,079 parts In-Stock

1+ parts

$8.985

100+ parts

$8.266

1k+ parts

-

10k+ parts

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2,079

$8.985

$8.266

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ChromeModa Solutions

Germany . 6,095 parts In-Stock

1+ parts

$9.168

100+ parts

$7.518

1k+ parts

-

10k+ parts

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6,095

$9.168

$7.518

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$9.168

100+ parts

$8.710

1k+ parts

$8.251

10k+ parts

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1,406

$9.168

$8.710

$8.251

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One Stop Electronics

USA . 1,533 parts In-Stock

1+ parts

$39.500

100+ parts

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1,533

$39.500

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Corphita

USA . 277 parts In-Stock

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277

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Microchip USA

USA . 167 parts In-Stock

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167

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Overview

Enhance your electronic projects with the TRS222CDW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This line driver and receiver is versatile and suited for a wide range of applications, providing customers with seamless connectivity and efficient data transmission. With its compact design and advanced features, the TRS222CDW offers exceptional value and performance, making it an essential component for your next project. Trust Texas Instruments to deliver innovative solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation and saves space on the circuit board.

Maximum Supply Voltage: 5.5 V

Operates within a safe voltage range, preventing damage to the product.

No. of Functions: 2

Offers versatile functionality for different applications.

Maximum Transmit Delay: 3500 ns

Ensures fast and efficient data transmission.

Power Supplies (V): 5

Compatible with standard power sources for easy integration.

No. of Terminals: 18

Provides ample connectivity options for different devices.

Maximum High Level Input Current: 0.00004 Amp

Helps in conserving energy and prevents overheating.

Minimum Supply Voltage: 4.5 V

Allows the product to operate efficiently even with slightly lower voltage inputs.

Maximum Operating Temperature: 70 °C

Ensures stability and performance even in high temperature environments.

Minimum Operating Temperature: 0 °C

Can function effectively in cold conditions as well.

Terminal Position: DUAL

Improves connectivity and signal transmission capabilities.

Maximum Seated Height: 2.65 mm

Compact design for space-saving installation.

Width: 7.5 mm

Sleek design for easy integration into circuit boards.

Maximum Output Low Current: 3.2 Amp

Allows for powering external devices without overloading the product.

Receiver No. of Bits: 2

High precision and accuracy in receiving data.

Length: 11.55 mm

Optimal size for fitting into various electronic devices.

Minimum Out Swing: 10 V

Ensures reliable signal transmission and reception.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Maximum Receive Delay: 1000 ns

Ensures timely reception of data signals.

Terminal Form: GULL WING

Enhances connectivity and stability on the circuit board.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compatible with industry-standard interfaces for seamless integration.

Maximum Supply Current: 10 mA

Low power consumption for energy efficiency.

Input Characteristics: SCHMITT TRIGGER

Ensures reliable and noise-immune signal processing.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level for easy compatibility.

Terminal Pitch: 1.27 mm

Optimal spacing for easy soldering and connections.

Driver No. of Bits: 2

High resolution in transmitting data signals.

Interface IC Type: LINE TRANSCEIVER

Enables bidirectional communication between devices.

Technical Specifications

Line Drivers & Receivers TRS222CDW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G18

Length:

11.55 mm

No. of Functions:

2

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

1000 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

3500 ns

Width:

7.5 mm

Trade Compliance

TRS222CDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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