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TRS211CDWRG4

Texas Instruments

TRS211CDWRG4 by Texas Instruments

TRS211CDWRG4 by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5V. It features a max supply voltage of 5.5V, input characteristics include SCHMITT TRIGGER. Ideal for applications requiring EIA-232-F, TIA-232-F, V.28 interface standard compliance and commercial temperature grade operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,632 parts In-Stock

1+ parts

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7,632

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Digiode

USA . 1,011 parts In-Stock

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1,011

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Distributors (Availability)

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One Stop Electronics

USA . 839 parts In-Stock

1+ parts

$3.500

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-

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839

$3.500

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Parana Technologies

USA . 603 parts In-Stock

1+ parts

$6.355

100+ parts

-

1k+ parts

$7.108

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603

$6.355

-

$7.108

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ChromeModa Solutions

Germany . 3,046 parts In-Stock

1+ parts

$7.140

100+ parts

$5.855

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3,046

$7.140

$5.855

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IDEA Electronic Components Group

UK . 1,223 parts In-Stock

1+ parts

$7.140

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-

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$6.426

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1,223

$7.140

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$6.426

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AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$11.802

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454

$11.802

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Component Stockers USA

USA . 211 parts In-Stock

1+ parts

$99.990

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211

$99.990

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Corphita

USA . 2,681 parts In-Stock

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2,681

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Microchip USA

USA . 2,249 parts In-Stock

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DigiPath Technology Company

USA . 208 parts In-Stock

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$6.437

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208

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$6.437

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Overview

Experience superior quality and reliability with the TRS211CDWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled performance in line drivers & receivers. This versatile product is perfect for a wide range of applications, offering customers value and benefits that set it apart from the competition. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to heat, making the product suitable for various environments.

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and making installation convenient.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power sources.

No. of Functions: 4

Having multiple functions in one package can simplify circuit design and reduce component count.

Maximum Output Low Current: 1.6 Amp

Capable of driving higher current loads, making it suitable for demanding applications.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry standards ensures compatibility with a wide range of devices and systems.

Technical Specifications

Line Drivers & Receivers TRS211CDWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.0002 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

4

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

10000 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TRS211CDWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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