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TRF3761EVM-X

Texas Instruments

TRF3761EVM-X by Texas Instruments

TRF3761EVM-X by Texas Instruments is a Timing Evaluation Board for TRF3761 IC. It features Single Integer-N PLL with VCO, packaged in a Box. Ideal for Frequency Synthesizer applications, it includes board(s) and cable(s) with MSL level 1.

Median Price

$212.460

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

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$212.460

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$212.460

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Distributors (In-Stock)

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Digiode

USA . 2,596 parts In-Stock

1+ parts

$201.837

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2,596

$201.837

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Vyrian

USA . 4,771 parts In-Stock

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4,771

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$180.590

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4

$180.590

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Semicontronic

India . 4 parts In-Stock

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$180.590

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$176.075

1k+ parts

$175.172

10k+ parts

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4

$180.590

$176.075

$175.172

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Corphita

USA . 4,148 parts In-Stock

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$191.214

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$191.214

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Corohmni

South Africa . 449 parts In-Stock

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$212.460

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449

$212.460

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ChromeModa Solutions

Germany . 4,948 parts In-Stock

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IDEA Electronic Components Group

UK . 1,292 parts In-Stock

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Parana Technologies

USA . 949 parts In-Stock

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$1.149

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949

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DigiPath Technology Company

USA . 697 parts In-Stock

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Perfect Parts

USA . 4 parts In-Stock

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Overview

Unlock endless possibilities with the TRF3761EVM-X by Texas Instruments. This high-quality Timing Evaluation Board offers a single Integer-N PLL with VCO, perfect for frequency synthesizer applications. Whether you're in the telecommunications industry or working on radio systems, this board provides unparalleled performance and precision. Experience the value and benefits of Texas Instruments' expertise in the field of development boards, kits, and programmers with the TRF3761EVM-X. Elevate your projects to new heights with this essential tool in your arsenal.

Feature Benefit Bullets

Package: Box

The product comes in a box package, ensuring that the components are protected during transportation and storage.

Type: Timing

This product is specifically designed for timing applications, ensuring accurate and precise frequency synthesis.

Function: Frequency Synthesizer

The product functions as a frequency synthesizer, making it ideal for applications that require stable and precise frequency control.

Utilized IC / Part: TRF3761

The product uses the TRF3761 IC/part, known for its performance and reliability in frequency synthesis applications.

Primary Attributes: Single Integer-N PLL with VCO

The product's primary attributes highlight its use of a single Integer-N PLL with VCO, providing highly accurate and stable frequency generation.

Supplied Contents: Board(s), Cable(s)

The product comes with necessary components like boards and cables, making it ready to use out of the box for evaluation and development purposes.

Base Product Number: TRF3761

The product is based on the TRF3761 series, ensuring compatibility and ease of use for customers familiar with this product line.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The product has a moisture sensitivity level of 1 (Unlimited), indicating that it can be stored and used in various environmental conditions without degradation.

Technical Specifications

Additional Parts TRF3761EVM-X attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TRF3761EVMX
TRF3761EVM-X-ND
296-31308

Function:

Frequency Synthesizer

Type:

Timing

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s), Cable(s)

Utilized IC / Part:

TRF3761

Package:

Box

Primary Attributes:

Single Integer-N PLL with VCO

Standard Package:

1

Base Product Number:

TRF3761

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TRF3761EVM-X Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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