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TPSM33625RDNR

Texas Instruments

TPSM33625RDNR by Texas Instruments

TPSM33625RDNR by Texas Instruments is a switching regulator with 2.5A output current, suitable for applications requiring a 3.3V output voltage. It operates b/w -40 to 125°C, supports input voltages from 3-36V, and utilizes pulse width modulation control technique with a max switching frequency of 1MHz.

Median Price

$2.576

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Texas Instruments

USA . 107,702 parts In-Stock

1+ parts

$2.576

100+ parts

$2.100

1k+ parts

$1.400

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107,702

$2.576

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$1.400

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Distributors (In-Stock)

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Digiode

USA . 3,563 parts In-Stock

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$2.447

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$2.447

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Ozdisan Elektronik

Türkiye . 75 parts In-Stock

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$2.767

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$2.767

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Nova Conductors

Japan . 200 parts In-Stock

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$3.750

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$3.750

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Vyrian

USA . 8,827 parts In-Stock

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Chip Stock

USA . 7,220 parts In-Stock

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NAC Semi

USA . 56 parts In-Stock

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$7.900

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NexGen Digital

USA . 10 parts In-Stock

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Semicontronic

India . 38,482 parts In-Stock

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$2.190

100+ parts

$2.135

1k+ parts

$2.124

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38,482

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$2.135

$2.124

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Ampacity Inc.

Singapore . 37,714 parts In-Stock

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$2.190

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Corphita

USA . 3,340 parts In-Stock

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$2.318

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Argo Parts USA

USA . 3,554 parts In-Stock

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$3.750

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Continental Prestige Electronics

USA . 3,202 parts In-Stock

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$3.750

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$3.675

3,202

$3.750

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$3.675

Advanced Electronics

New Zealand . 40 parts In-Stock

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$3.825

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$3.825

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$3.825

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40

$3.825

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$3.825

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Futuretech Components

Singapore . 500 parts In-Stock

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Corohmni

South Africa . 283 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$37.063

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$37.063

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$37.063

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$37.063

$37.063

$37.063

Netroflash

USA . 50 parts In-Stock

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$3.675

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$3.562

10k+ parts

$3.488

50

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$3.675

$3.562

$3.488

Overview

Unleash the power of cutting-edge technology with the TPSM33625RDNR by Texas Instruments. This switching regulator and controller combines top-notch quality with Texas Instrument's renowned expertise to deliver unmatched performance in a wide range of applications. With a compact design, high efficiency, and precise control, this product ensures optimal power management for your systems. Say goodbye to energy waste and hello to improved reliability and functionality with the TPSM33625RDNR - the ultimate solution for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of board space, making it ideal for compact designs.

No. of Terminals: 11

With 11 terminals, this product offers flexibility in connecting to other components, expanding the range of possible configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style enhances thermal performance and overall efficiency of the product.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Output Voltage: 1 V

The minimum output voltage of 1V allows for precise power control, making it suitable for a wide range of applications.

Control Mode: CURRENT-MODE

The current-mode control mode offers excellent regulation and stability, making this product an efficient choice for power management.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can withstand extreme cold conditions, making it suitable for diverse environments.

Terminal Finish: TIN

The terminal finish of tin provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Maximum Output Voltage: 15 V

The high maximum output voltage of 15V offers versatility in power supply options, making this product suitable for a variety of applications.

Terminal Position: QUAD

The quad terminal position allows for easy installation and connection, streamlining the integration process.

Maximum Seated Height: 2.1 mm

The low maximum seated height of 2.1mm enables a compact design with efficient use of space.

Width (mm): 3.5 mm

The narrow width of 3.5mm makes this product suitable for applications with space constraints, providing flexibility in design.

Other IC type: SWITCHING REGULATOR

Being a switching regulator, this product offers high efficiency and voltage regulation, making it a reliable choice for power management.

Nominal Input Voltage: 24 V

The nominal input voltage of 24V ensures compatibility with a wide range of power sources, enhancing the versatility of this product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260C allows for efficient soldering processes, ensuring reliable connections.

Length: 4.5 mm

The compact length of 4.5mm contributes to a space-saving design, making this product suitable for applications with tight layout constraints.

Maximum Switching Frequency: 1000 kHz

The high maximum switching frequency of 1000kHz enables fast and efficient power conversion, enhancing the performance of the product.

Maximum Output Current: 2.5 A

With a maximum output current of 2.5A, this product can handle high power loads, making it suitable for demanding applications.

Technology: HYBRID

The hybrid technology used in this product combines the advantages of different technologies, offering a balance of performance and efficiency.

Terminal Form: NO LEAD

The terminal form without leads simplifies assembly and enhances the reliability of connections, ensuring consistent performance.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique provides precise regulation of output voltage, ensuring stable and efficient power conversion.

Switcher Config: BUCK

The buck switcher configuration allows for step-down voltage conversion, making this product suitable for applications that require lower output voltage.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product has moderate sensitivity to moisture, suitable for applications in environments with controlled moisture levels.

Minimum Input Voltage: 3 V

The minimum input voltage of 3V ensures compatibility with a wide range of power sources, offering flexibility in system design.

Nominal Output Voltage: 3.3 V

The nominal output voltage of 3.3V provides a stable power supply for various components, ensuring reliable performance.

Maximum Input Voltage: 36 V

The high maximum input voltage of 36V allows for compatibility with different power sources, making this product versatile for various applications.

Technical Specifications

Switching Regulators & Controllers TPSM33625RDNR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

PFM CONTROL ALSO POSSIBLE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

36 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

24 V

JESD-30 Code:

R-PQCC-N11

JESD-609 Code:

e3

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

11

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.5 A

Maximum Output Voltage:

15 V

Minimum Output Voltage:

1 V

Nominal Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC11,.18X.14(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1000 kHz

Technology:

HYBRID

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Width (mm):

3.5 mm

Trade Compliance

TPSM33625RDNR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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