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TPS76533DG4

Texas Instruments

TPS76533DG4 by Texas Instruments

TPS76533DG4 by Texas Instruments is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.15A. It operates in an extended temperature range from -40 to 125°C, making it suitable for various applications requiring stable voltage regulation in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,346 parts In-Stock

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Digiode

USA . 4,642 parts In-Stock

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Bristol Electronics

USA . 799 parts In-Stock

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799

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Distributors (Availability)

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Parana Technologies

USA . 2,197 parts In-Stock

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$4.178

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$4.619

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2,197

$4.178

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$4.619

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Ampacity Inc.

Singapore . 1,589 parts In-Stock

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$4.500

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$4.500

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DigiPath Technology Company

USA . 1,269 parts In-Stock

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$4.600

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$4.232

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1,269

$4.600

$4.232

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IDEA Electronic Components Group

UK . 1,898 parts In-Stock

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$4.694

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$4.225

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1,898

$4.694

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$4.225

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ChromeModa Solutions

Germany . 844 parts In-Stock

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$4.694

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$3.849

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844

$4.694

$3.849

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Semicontronic

India . 761 parts In-Stock

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$12.500

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$12.188

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$12.125

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761

$12.500

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$12.125

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One Stop Electronics

USA . 1,541 parts In-Stock

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$17.500

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1,541

$17.500

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AZTECH Wire

Italy . 875 parts In-Stock

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$18.130

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QUARKTWIN TECHNOLOGY LTD

USA . 27,671 parts In-Stock

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Microchip USA

USA . 2,595 parts In-Stock

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Corphita

USA . 1,244 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 216 parts In-Stock

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Corohmni

South Africa . 206 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the TPS76533DG4 by Texas Instruments, a top-of-the-line Fixed Regulator that guarantees reliability and efficiency. Designed using cutting-edge PMOS technology, this regulator ensures a stable output voltage of 3.3V with minimal dropout voltage, making it ideal for a wide range of applications. With Texas Instruments' reputation for quality and innovation, you can trust that this regulator will deliver exceptional results, providing value and peace of mind to customers seeking superior power management solutions. Elevate your electronics with the TPS76533DG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Dropout Voltage-1: 1.24 V

Low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Operating Temperature (TJ-Max): 125 °C

High maximum operating temperature ensures reliability in varying temperature conditions.

Technology: PMOS

PMOS technology offers low power consumption and high efficiency.

Minimum Output Voltage-1: 3.201 V

Stable minimum output voltage ensures consistent performance.

Nominal Output Voltage-1: 3.3 V

Nominal output voltage provides a standard power supply for compatible devices.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for compact design and space-saving on the PCB.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Fixed regulator type provides a stable and reliable power source for electronic circuits.

Technical Specifications

Fixed Regulators - Positive Single Output LDO TPS76533DG4 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.24 V

Nominal Dropout Voltage-1:

.085 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

10 V

Minimum Input Voltage:

3.639 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Maximum Load Regulation:

.0099 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

PMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

3.9 mm

Trade Compliance

TPS76533DG4 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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