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TPS73130DBVRG4

Texas Instruments

TPS73130DBVRG4 by Texas Instruments

TPS73130DBVRG4 by Texas Instruments is a fixed positive single output LDO regulator with a nominal output voltage of 3V and max output current of 0.15A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring stable voltage regulation in compact electronic devices. With a small outline package style and surface mount capability, it offers efficient power management solutions for portable electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 64,500 parts In-Stock

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64,500

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Vyrian

USA . 7,656 parts In-Stock

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7,656

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Prism Electronics

USA . 2,873 parts In-Stock

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2,873

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Digiode

USA . 826 parts In-Stock

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826

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,144 parts In-Stock

1+ parts

$1.500

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1,144

$1.500

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Corohmni

South Africa . 362 parts In-Stock

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$7.032

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362

$7.032

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Parana Technologies

USA . 1,384 parts In-Stock

1+ parts

$8.377

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$9.007

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1,384

$8.377

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$9.007

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Semicontronic

India . 663 parts In-Stock

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$8.500

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$8.288

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$8.245

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663

$8.500

$8.288

$8.245

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DigiPath Technology Company

USA . 2,160 parts In-Stock

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$9.224

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$8.486

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$9.224

$8.486

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ChromeModa Solutions

Germany . 2,090 parts In-Stock

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$9.412

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$7.718

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$9.412

$7.718

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IDEA Electronic Components Group

UK . 1,851 parts In-Stock

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$9.412

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$8.941

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$8.471

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One Stop Electronics

USA . 228 parts In-Stock

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$11.500

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AZTECH Wire

Italy . 319 parts In-Stock

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$14.686

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319

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Kepictronics

USA . 306,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,271 parts In-Stock

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Corphita

USA . 4,915 parts In-Stock

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Argo Parts USA

USA . 4,410 parts In-Stock

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Perfect Parts

USA . 3,218 parts In-Stock

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Microchip USA

USA . 984 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Advanced Electronics

New Zealand . 81 parts In-Stock

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Overview

Enhance your electronic projects with the TPS73130DBVRG4 by Texas Instruments, a reliable fixed positive single output LDO regulator that offers precision and efficiency. Manufactured with top-notch quality materials and cutting-edge BICMOS technology, this regulator ensures stable performance in a compact package. Ideal for a wide range of applications, this device guarantees a minimum dropout voltage and maximum output current, providing value and benefits that will elevate your designs to the next level. Upgrade your projects with the TPS73130DBVRG4 and experience unparalleled reliability and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable for various applications.

Maximum Dropout Voltage-1: 0.1 V

With a low dropout voltage, this regulator ensures efficient power conversion even in low voltage scenarios.

Surface Mount: YES

Being surface mountable simplifies installation and saves space on the PCB, making it a convenient choice for compact designs.

Operating Temperature (TJ-Max): 125 °C

With a maximum operating temperature of 125°C, this regulator can withstand high temperatures, ensuring reliability in challenging environments.

Technology: BICMOS

The BICMOS technology used in this regulator provides a combination of high performance and low power consumption for efficient operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit designs, making it a versatile choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering, ensuring a reliable electrical connection.

Operating Temperature (TJ-Min): -40 °C

With a minimum operating temperature of -40°C, this regulator is suitable for use in extreme cold conditions.

Packing Method: TR

The TR packing method ensures proper protection during shipping and storage, maintaining the integrity of the product.

Minimum Output Voltage-1: 2.97 V

The minimum output voltage of 2.97V guarantees reliable power supply for connected devices, making it a suitable choice for various applications.

Maximum Voltage Tolerance: 1 %

The tight voltage tolerance of 1% ensures consistent and accurate output voltage, making this regulator a dependable choice for precision applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO TPS73130DBVRG4 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.03 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3.1 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.03 V

Minimum Output Voltage-1:

2.97 V

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

1 %

Width:

1.6 mm

Trade Compliance

TPS73130DBVRG4 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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