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TPS72525KTTTG3

Texas Instruments

TPS72525KTTTG3 by Texas Instruments

TPS72525KTTTG3 by Texas Instruments is a fixed positive single output LDO regulator with a max output current of 1A and dropout voltage of 0.28V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,189 parts In-Stock

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Digiode

USA . 4,678 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 463 parts In-Stock

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$7.309

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463

$7.309

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Parana Technologies

USA . 1,994 parts In-Stock

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$7.759

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$8.300

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$7.759

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DigiPath Technology Company

USA . 1,557 parts In-Stock

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$8.544

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$7.860

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$8.544

$7.860

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IDEA Electronic Components Group

UK . 1,943 parts In-Stock

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$8.718

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$8.282

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$7.846

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1,943

$8.718

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$7.846

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ChromeModa Solutions

Germany . 366 parts In-Stock

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$8.718

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$7.149

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366

$8.718

$7.149

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Semicontronic

India . 779 parts In-Stock

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$17.500

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$17.062

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$16.975

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779

$17.500

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$16.975

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One Stop Electronics

USA . 1,310 parts In-Stock

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$19.500

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QUARKTWIN TECHNOLOGY LTD

USA . 16,896 parts In-Stock

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Corphita

USA . 3,584 parts In-Stock

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Microchip USA

USA . 407 parts In-Stock

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Corohmni

South Africa . 397 parts In-Stock

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Perfect Parts

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Overview

Looking for a reliable Fixed Regulator that delivers top-notch performance? Look no further than the TPS72525KTTTG3 by Texas Instruments. With a reputation for superior quality and innovation, Texas Instruments has created a game-changing product in the realm of Positive Single Output LDOs. Ideal for a wide range of applications, this regulator offers customers unparalleled value, efficiency, and precision. Say goodbye to power concerns and hello to peace of mind with the TPS72525KTTTG3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Dropout Voltage: 1.28 V

Low dropout voltage ensures efficient power conversion and minimal power loss, making the product energy-efficient.

Surface Mount: YES

Surface mount capability enables easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows the product to function reliably in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for sensitive electronic applications.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of space on PCBs and allows for easy integration into electronic systems.

Terminal Form: GULL WING

Gull wing terminal form ensures secure and reliable connections to the PCB, reducing the risk of disconnection or malfunction.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range ensures the product can operate even in extreme cold conditions without performance degradation.

Packing Method: TUBE

Tube packaging protects the product during transportation and storage, reducing the risk of damage before installation.

Minimum Output Voltage: 2.45 V

Stable minimum output voltage ensures consistent performance and reliable power supply for connected devices.

Technical Specifications

Fixed Regulators - Positive Single Output LDO TPS72525KTTTG3 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.28 V

Maximum Input Voltage Absolute:

7 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.78 V

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Length:

10.16 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

2.55 V

Minimum Output Voltage-1:

2.45 V

Nominal Output Voltage-1:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

5.13 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

8.925 mm

Trade Compliance

TPS72525KTTTG3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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